Inventor · disambiguated record
Koji Hosaka
Also filed as: HOSAKA KOJI
10 granted patents·5 pending applications·27 citations·filing 2001–2023
84Inventor score
Files withSEIKO EPSON CORP3HITACHI HIGH TECH INSTR CO LTD2SAE MAGNETICS HK LTD2UNIV FLORIDA2FASFORD TECH CO LTD1
Top patents by PatentIndex Score
15 records- 0182US7153198B2Fixture for slider lapping, lapping device and lapping methodSAE MAGNETICS HK LTD·Filed 2005·Granted Dec 26, 2006·7 cites·9 claims
- 0275US8384405B2Method for performing burn-in testTDK CORP·Filed 2011·Granted Feb 26, 2013·3 cites·10 claims
- 0374US9362886B2Electronic component, oscillator, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Granted Jun 7, 2016·2 cites·20 claims
- 0465US9577604B2Electronic component, oscillator, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2016·Granted Feb 21, 2017·1 cites·20 claims
- 0565US7539174B2Mobile communication system, mobile station device, and network-side deviceNTT DOCOMO INC·Filed 2005·Granted May 26, 2009·4 cites·4 claims
- 0664US6791424B2Piezoelectric oscillatorTOYO COMMUNICATION EQUIP·Filed 2001·Granted Sep 14, 2004·10 cites·8 claims
- 0762US2025144179A1Peptide hormone to prevent or treat vasospasm, brain injury or cerebral edemaUNIV FLORIDA·Filed 2023·Application pending·0 cites
- 0855US2023102414A1Methods, devices, and compositions for lesion repair and preventionUNIV FLORIDA·Filed 2021·Application pending·0 cites
- 0943US11692947B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1043US7768281B2Probe assembly for lapping a bar using a patterned probeSAE MAGNETICS HK LTD·Filed 2008·Granted Aug 3, 2010·0 cites·14 claims
- 1141US2019149091A1Vibrator group manufacturing method and oscillator manufacturing methodSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 1235US7435163B2Grinding sheet and grinding methodTMP CO LTD·Filed 2007·Granted Oct 14, 2008·0 cites·6 claims
- 1333US2013014904A1Biaxial Drive Mechanism and Die BonderHITACHI HIGH TECH INSTR CO LTD·Filed 2011·Application pending·0 cites
- 1433US2013014881A1Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating MethodHITACHI HIGH TECH INSTR CO LTD·Filed 2011·Application pending·0 cites
- 1523US10601741B2Message transmission device and message transmission methodHOSAKA KOJI·Filed 2017·Granted Mar 24, 2020·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →