Inventor · disambiguated record
Koichiro Ichikawa
Also filed as: ICHIKAWA KOICHIRO
10 granted patents·2 pending applications·202 citations·filing 1994–2008
90Inventor score
Files withSHINETSU HANDOTAI KK8BORUCKI LEONARD1SATO UNKAI1SHIN ETSU HANDOTAL CO LTD1SUDARGHO FRANSISCA MARIA ASTRID1
Top patents by PatentIndex Score
12 records- 0181US5733181AApparatus for polishing the notch of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Mar 31, 1998·38 cites·11 claims
- 0280US5727990AMethod for mirror-polishing chamfered portion of wafer and mirror-polishing apparatusSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 17, 1998·49 cites·8 claims
- 0380US5476413AApparatus for polishing the periphery portion of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Dec 19, 1995·52 cites·6 claims
- 0465US6332828B1Method of and apparatus for mirror-like polishing wafer chamfer with orientation flatSHINETSU HANDOTAI KK·Filed 2000·Granted Dec 25, 2001·10 cites·4 claims
- 0558US5458529AApparatus for polishing notch portion of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Oct 17, 1995·15 cites·16 claims
- 0657US5928066AApparatus for polishing peripheral portion of waferSHINETSU HANDOTAI KK·Filed 1997·Granted Jul 27, 1999·19 cites·16 claims
- 0746US2010099333A1Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishingSUDARGHO FRANSISCA MARIA ASTRID·Filed 2008·Application pending·0 cites
- 0841US2010112905A1Wafer head template for chemical mechanical polishing and a method for its useBORUCKI LEONARD·Filed 2008·Application pending·0 cites
- 0937US5429544APolishing apparatus for notch portion of waferSHIN ETSU HANDOTAL CO LTD·Filed 1994·Granted Jul 4, 1995·10 cites·17 claims
- 1035US6113463AMethod of and apparatus for mirror-like polishing wafer chamfer with orientation flatSHINETSU HANDOTAI KK·Filed 1996·Granted Sep 5, 2000·6 cites·4 claims
- 1131US8333882B2Polishing apparatus and method of polishing workSATO UNKAI·Filed 2006·Granted Dec 18, 2012·0 cites·9 claims
- 1231US5766065AApparatus for polishing peripheral portion of waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jun 16, 1998·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →