Inventor · disambiguated record
Kosuke Ikeda
Also filed as: IKEDA KOSUKE
46 granted patents·13 pending applications·24 citations·filing 2010–2024
95Inventor score
Files withSHINDENGEN ELECTRIC MFG32IBIDEN CO LTD10MITSUBISHI HEAVY IND LTD8ADVANTEST CORP6HORAGUCHI NORIHISA1
Top patents by PatentIndex Score
59 records- 0183US9669573B2Injection molding apparatus and injection molding methodMITSUBISHI HEAVY IND PLASTIC TECH CO LTD·Filed 2013·Granted Jun 6, 2017·6 cites·24 claims
- 0277US9538642B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jan 3, 2017·3 cites·20 claims
- 0374US9775237B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Sep 26, 2017·2 cites·20 claims
- 0471US9997437B2Power semiconductor module for improved thermal performanceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Jun 12, 2018·2 cites·9 claims
- 0571US9892993B2Semiconductor module having stacked insulated substrate structuresSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Feb 13, 2018·2 cites·8 claims
- 0671US9386698B2Module, module combined body and module production methodSHINDENGEN ELECTRIC MFG·Filed 2013·Granted Jul 5, 2016·3 cites·10 claims
- 0767US9991184B2Electronic module and method of manufacturing the sameSHINDENGEN ELECTRIC MFG·Filed 2013·Granted Jun 5, 2018·2 cites·10 claims
- 0866US12381410B2Charging deviceTOYOTA MOTOR CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·3 claims
- 0964US11104769B2Pultruded material and method for manufacturing pultruded materialMITSUBISHI HEAVY IND LTD·Filed 2019·Granted Aug 31, 2021·0 cites·10 claims
- 1062US2024393383A1Semiconductor test result analysis device, semiconductor test result analysis method, and recording mediumADVANTEST CORP·Filed 2024·Application pending·0 cites
- 1161US10319704B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Jun 11, 2019·1 cites·12 claims
- 1260US9704828B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2014·Granted Jul 11, 2017·1 cites·2 claims
- 1359US11052674B2Exhaust device for inkjet coating, inkjet ejection device, inkjet coating method, and method for manufacturing memberMITSUBISHI HEAVY IND LTD·Filed 2020·Granted Jul 6, 2021·0 cites·14 claims
- 1459US10159166B2Heat dissipating structureSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Dec 18, 2018·1 cites·9 claims
- 1559US9871788B2Authentication terminalADVANTEST CORP·Filed 2015·Granted Jan 16, 2018·1 cites·9 claims
- 1659US2024393389A1Semiconductor test result analysis device, semiconductor test result analysis method, and recording mediumADVANTEST CORP·Filed 2024·Application pending·0 cites
- 1758US11729912B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·22 claims
- 1858US11486904B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Nov 1, 2022·0 cites·7 claims
- 1957US12309920B2Wiring substrateIBIDEN CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 2056US2023380055A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 2156US2023380076A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 2255US12272489B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Apr 8, 2025·0 cites·8 claims
- 2352US12148562B2Magnetic componentSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Nov 19, 2024·0 cites·6 claims
- 2452US12051536B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Jul 30, 2024·0 cites·9 claims
- 2552US2021122094A1Molding method and molding deviceMITSUBISHI HEAVY IND LTD·Filed 2019·Application pending·0 cites
- 2651US2022300390A1Determination apparatus, test system, determination method, and computer- readable mediumADVANTEST CORP·Filed 2022·Application pending·0 cites
- 2749US10410784B2Magnetic componentSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Sep 10, 2019·0 cites·5 claims
- 2849US2021162637A1Composite material injection molding method and composite materialMITSUBISHI HEAVY IND LTD·Filed 2019·Application pending·0 cites
- 2949US2021170654A1Molding method and molding deviceMITSUBISHI HEAVY IND LTD·Filed 2019·Application pending·0 cites
- 3048US11967451B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Apr 23, 2024·0 cites·6 claims
- 3148US11322448B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted May 3, 2022·0 cites·9 claims
- 3248US11309250B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Apr 19, 2022·0 cites·8 claims
- 3347US10641276B2ImpellerMITSUBISHI HEAVY IND LTD·Filed 2015·Granted May 5, 2020·0 cites·15 claims
- 3445US11244443B2Examination apparatus, examination method, recording medium storing an examination program, learning apparatus, learning method, and recording medium storing a learning programADVANTEST CORP·Filed 2019·Granted Feb 8, 2022·0 cites·15 claims
- 3544US10748700B2Coil structure and magnetic componentSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Aug 18, 2020·0 cites·5 claims
- 3644US10251256B2Heat dissipating structureSHINDENGEN ELECTRIC MFG·Filed 2014·Granted Apr 2, 2019·0 cites·6 claims
- 3743US11437340B2Electronic module, method of manufacturing connector, and method of manufacturing electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Sep 6, 2022·0 cites·1 claims
- 3843US2019329464A1Method for determining thickness of resin layer of insert film, method for manufacturing insert film-equipped molded resin article, and insert filmMITSUBISHI HEAVY IND LTD·Filed 2017·Application pending·0 cites
- 3942US11161290B2Method for manufacturing impellerMITSUBISHI HEAVY IND LTD·Filed 2015·Granted Nov 2, 2021·0 cites·20 claims
- 4041US11776937B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Oct 3, 2023·0 cites·6 claims
- 4141US11437298B2Electronic module and method for manufacturing electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Sep 6, 2022·0 cites·5 claims
- 4241US11276663B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Mar 15, 2022·0 cites·7 claims
- 4340US11264351B2Method of manufacturing chip moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Mar 1, 2022·0 cites·7 claims
- 4440US11189591B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Nov 30, 2021·0 cites·9 claims
- 4539US11309273B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 19, 2022·0 cites·5 claims
- 4639US10269775B2Semiconductor device and method for manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Apr 23, 2019·0 cites·7 claims
- 4738US11658109B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted May 23, 2023·0 cites·3 claims
- 4838US11037870B2Electronic module, lead frame and manufacturing method for electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jun 15, 2021·0 cites·12 claims
- 4938US10510636B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Dec 17, 2019·0 cites·6 claims
- 5038US10070523B2Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →