Inventor · disambiguated record
Koji Imayoshi
Also filed as: IMAYOSHI KOJI
8 granted patents·2 pending applications·269 citations·filing 1996–2020
85Inventor score
Files withTOPPAN PRINTING CO LTD9
Top patents by PatentIndex Score
10 records- 0193US5667853AMultilayered conductive film, and transparent electrode substrate and liquid crystal device using the sameTOPPAN PRINTING CO LTD·Filed 1996·Granted Sep 16, 1997·191 cites·16 claims
- 0289US6483562B1Electrode substrate and reflection type liquid crystal display device having low compatibility between resinsTOPPAN PRINTING CO LTD·Filed 2000·Granted Nov 19, 2002·41 cites·39 claims
- 0370US6249082B1Electrode plate having transparent type or reflective type multi-layered conductive film and method for manufacturing the sameTOPPAN PRINTING CO LTD·Filed 1999·Granted Jun 19, 2001·34 cites·17 claims
- 0469US10056322B2Interposers, semiconductor devices, method for manufacturing interposers, and method for manufacturing semiconductor devicesTOPPAN PRINTING CO LTD·Filed 2016·Granted Aug 21, 2018·3 cites·11 claims
- 0561US11081368B2Method of dicing wiring substrate, and packaging substrateTOPPAN PRINTING CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·20 claims
- 0656US10679865B2Method of dicing wiring substrate, and packaging substrateTOPPAN PRINTING CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·3 claims
- 0750US11006516B2Wiring board, semiconductor device, and method of manufacturing wiring boardTOPPAN PRINTING CO LTD·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 0839US10790209B2Wiring circuit substrate, semiconductor device, method of producing the wiring circuit substrate, and method of producing the semiconductor deviceTOPPAN PRINTING CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·14 claims
- 0937US2001026120A1Method for manufacturing electrode plate having transparent type or reflective type multi-layered conductive filmFiled 2001·Application pending·0 cites
- 1035US2017250141A1Wiring circuit board, semiconductor device, method of manufacturing wiring circuit board, and method of manufacturing semiconductor deviceTOPPAN PRINTING CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →