Inventor · disambiguated record
Kohichiro Kawate
Also filed as: KAWATE KOHICHIRO
14 granted patents·20 pending applications·215 citations·filing 1993–2019
92Inventor score
Files with3M INNOVATIVE PROPERTIES CO16KAWATE KOHICHIRO8MINNESOTA MINING & MFG2KAWATE YOSHIHISA1SATO YOSHIAKI1
Top patents by PatentIndex Score
34 records- 0184US6753379B1Heat activated adhesive3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Jun 22, 2004·61 cites·3 claims
- 0274US7888604B2Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method3M INNOVATIVE PROPERTIES CO·Filed 2006·Granted Feb 15, 2011·6 cites·13 claims
- 0374US6265460B1Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Jul 24, 2001·45 cites·9 claims
- 0466US6051652AReactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive3M INNOVATIVE PROPERTIES CO·Filed 1996·Granted Apr 18, 2000·23 cites·5 claims
- 0565US6908318B2Batch electrically connecting sheet3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Jun 21, 2005·11 cites·7 claims
- 0664US9281255B2Underfill composition and semiconductor device and manufacturing method thereof3M INNOVATIVE PROPERTIES CO·Filed 2013·Granted Mar 8, 2016·1 cites·12 claims
- 0764US6228500B1Adhesive composition and precursor thereof3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted May 8, 2001·24 cites·19 claims
- 0859US7358289B2Heat-curable adhesive composition3M INNOVATIVE PROPERTIES CO·Filed 2003·Granted Apr 15, 2008·4 cites·8 claims
- 0958US7779538B2Method for mutually connecting circuit boards3M INNOVATIVE PROPERTIES CO·Filed 2006·Granted Aug 24, 2010·1 cites·10 claims
- 1056US5759090ASanding pad containing a heat distortable polymer and sanding process using sameMINNESOTA MINING & MFG·Filed 1995·Granted Jun 2, 1998·30 cites·4 claims
- 1155US9230873B2Semiconductor package resin composition and usage method thereofKAWATE KOHICHIRO·Filed 2012·Granted Jan 5, 2016·1 cites·5 claims
- 1250US5382641AHeat-sensitive imaging materialMINNESOTA MINING & MFG·Filed 1993·Granted Jan 17, 1995·8 cites·6 claims
- 1349US2008090085A1Heat curable adhesive composition, article, semiconductor apparatus and method3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
- 1448US2010206623A1Nonconductive adhesive composition and film and methods of makingKAWATE KOHICHIRO·Filed 2008·Application pending·0 cites
- 1547US9773714B2Semiconductor package resin composition and usage method thereof3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Sep 26, 2017·0 cites·3 claims
- 1646US11124646B2Heat-dissipating resin composition, cured product thereof, and method of using same3M INNOVATIVE PROPERTIES CO·Filed 2017·Granted Sep 21, 2021·0 cites·9 claims
- 1746US2021193099A1Vibration absorbing material3M INNOVATIVE PROPERTIES CO·Filed 2019·Application pending·0 cites
- 1845US2011000700A1Method of connecting circuit boards and connected structureSATO YOSHIAKI·Filed 2007·Application pending·0 cites
- 1944US2008013594A1Nondestructive Inspection Method For Inspecting Junction Of Flexible Printed Circuit Board3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 2044US2011163569A1Terminal mounting structure and methodYONEYAMA MIKI·Filed 2009·Application pending·0 cites
- 2143US2004063804A1Thermosetting adhesiveFiled 2002·Application pending·0 cites
- 2243US2016007453A1High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board3M INNOVATIVE PROPERTIES CO·Filed 2014·Application pending·0 cites
- 2341US2010197368A1Cable harness body3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 2441US2002056949A1Process for producing polymeric films having shape-memorizing propertiesFiled 2001·Application pending·0 cites
- 2538US2008283280A1Method for Connecting Printed Circuit BoardsKAWATE KOHICHIRO·Filed 2006·Application pending·0 cites
- 2637US2008156437A1Method for Connecting Flexible Printed Circuit Board to Another Circuit BoardKAWATE KOHICHIRO·Filed 2006·Application pending·0 cites
- 2737US2004068061A1Thermosetting adhesive film, and an adhesive structure based on the use thereofFiled 2002·Application pending·0 cites
- 2837US2009127692A1Method of connecting a semiconductor package to a printed wiring boardKAWATE KOHICHIRO·Filed 2005·Application pending·0 cites
- 2936US2009321015A1Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the sameKAWATE KOHICHIRO·Filed 2007·Application pending·0 cites
- 3035US2004185237A1Sheet for sealing electrical wiringFiled 2002·Application pending·0 cites
- 3135US2005233161A1Thermosetting adhesive sheet with electroconductive and thermoconductive propertiesTAKEDA MASAAKI·Filed 2003·Application pending·0 cites
- 3233US2007224397A1Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection MethodKAWATE YOSHIHISA·Filed 2005·Application pending·0 cites
- 3333US2005224978A1Heat curable adhesive composition, article, semiconductor apparatus and methodKAWATE KOHICHIRO·Filed 2003·Application pending·0 cites
- 3431US2014096622A1Film laminate body for pressure sensitive fingerprint sensorKAWATE KOHICHIRO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →