Inventor · disambiguated record
Koji Kishino
Also filed as: KISHINO KOJI
12 granted patents·4 pending applications·82 citations·filing 1989–2020
85Inventor score
Top patents by PatentIndex Score
16 records- 0185US5197779APower sliding sunroofMAZDA MOTOR·Filed 1991·Granted Mar 30, 1993·57 cites·11 claims
- 0278US11638349B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·19 claims
- 0361US4927207AGlass construction for an automobileMAZDA MOTOR·Filed 1989·Granted May 22, 1990·24 cites·25 claims
- 0456US9516746B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted Dec 6, 2016·0 cites·5 claims
- 0555US9795030B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 17, 2017·0 cites·9 claims
- 0655US9661749B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted May 23, 2017·0 cites·12 claims
- 0754US9102850B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 11, 2015·0 cites·8 claims
- 0851US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 0950US11452216B2Method for manufacturing multilayer printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 20, 2022·0 cites·10 claims
- 1050US9578734B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2013·Granted Feb 21, 2017·0 cites·18 claims
- 1149US2002029169A1Method and system for e-transactionFiled 2001·Application pending·0 cites
- 1248US2020157300A1Resin composition, prepreg, metal-clad laminate, printed wiring board, and method for fabricating the metal-clad laminatePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1344US10009997B2Metal-clad laminate and printed wiring boardINOUE HIROHARU·Filed 2012·Granted Jun 26, 2018·0 cites·11 claims
- 1440US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 1539US2022259378A1Resin composition, prepreg, method for manufacturing prepreg, laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1637US9480148B2Metal-clad laminate and printed wiring boardINOUE HIROHARU·Filed 2012·Granted Oct 25, 2016·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →