Inventor · disambiguated record
Kota Kitajima
Also filed as: KITAJIMA KOTA
0 granted patents·2 pending applications·0 citations·filing 2012–2023
Top patents by PatentIndex Score
2 records- 0154US2024107678A1Method of manufacturing bonded substrate, method of manufacturing circuit substrate, and circuit substrateNGK ELECTRONICS DEVICES INC·Filed 2023·Application pending·0 cites
- 0253US2014242288A1Reducing electroless silver plating solution and reducing electroless silver plating methodUYEMURA C & CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →