Inventor · disambiguated record
Koei Kuribayashi
Also filed as: KURIBAYASHI KOEI
16 granted patents·11 pending applications·13 citations·filing 2010–2024
87Inventor score
Files withKOKUSAI ELECTRIC CORP19HITACHI INT ELECTRIC INC4SASAKI TAKAFUMI2KURIBAYASHI KOEI1SHIRAKO KENJI1
Top patents by PatentIndex Score
27 records- 0180US10784116B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 22, 2020·3 cites·17 claims
- 0279US11753716B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Sep 12, 2023·1 cites·14 claims
- 0376US8409352B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusKURIBAYASHI KOEI·Filed 2011·Granted Apr 2, 2013·6 cites·13 claims
- 0475US12148621B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
- 0572US2025022708A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0670US12065736B2Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 20, 2024·0 cites·15 claims
- 0770US9982347B2Cleaning method, method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted May 29, 2018·1 cites·7 claims
- 0867US9508531B2Method of manufacturing semiconductor device by alternatively increasing and decreasing pressure of process chamberHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·2 cites·9 claims
- 0964US11621169B2Method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·0 cites·16 claims
- 1063US12148614B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 1160US2025101593A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1259US11788188B2Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 17, 2023·0 cites·6 claims
- 1359US2024247367A1Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1458US2024105463A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1557US2024229229A9Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1656US2023230845A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1755US2023268181A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1854US2023091654A1Method of processing substrate, recording medium, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1953US12053805B2Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 2053US2023223265A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2150US2022301850A1Substrate Processing Apparatus, Non-transitory Computer-readable Recording Medium, Substrate Processing Method and Method of Manufacturing Semiconductor DeviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2248US12139787B2Apparatus and method for cleaning reaction vessel for processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 12, 2024·0 cites·14 claims
- 2345US9976214B2Cleaning method and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted May 22, 2018·0 cites·17 claims
- 2438US11814725B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 2538US8889533B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusSASAKI TAKAFUMI·Filed 2011·Granted Nov 18, 2014·0 cites·16 claims
- 2636US8450220B2Substrate processing apparatus , method of manufacturing semiconductor device, and method of manufacturing substrateSASAKI TAKAFUMI·Filed 2010·Granted May 28, 2013·0 cites·20 claims
- 2732US2012156886A1Substrate processing apparatus, method of manufacturing substrate, and method of manufacturing semiconductor deviceSHIRAKO KENJI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →