Inventor · disambiguated record
Koji Matsui
Also filed as: MATSUI KOJI
50 granted patents·8 pending applications·1,308 citations·filing 1982–2022
99Inventor score
Top patents by PatentIndex Score
58 records- 0198US7338884B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2004·Granted Mar 4, 2008·286 cites·17 claims
- 0292US6861757B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2002·Granted Mar 1, 2005·55 cites·46 claims
- 0391US5830563AInterconnection structures and method of making sameNEC CORP·Filed 1996·Granted Nov 3, 1998·85 cites·9 claims
- 0487US6841862B2Semiconductor package board using a metal baseNEC CORP·Filed 2001·Granted Jan 11, 2005·33 cites·25 claims
- 0585US6278153B1Thin film capacitor formed in viaNEC CORP·Filed 1999·Granted Aug 21, 2001·62 cites·30 claims
- 0684US7696007B2Semiconductor package board using a metal baseNEC CORP·Filed 2009·Granted Apr 13, 2010·8 cites·21 claims
- 0784US6087285AZirconia sintered body, process for production thereof, and application thereofTOSOH CORP·Filed 1998·Granted Jul 11, 2000·67 cites·6 claims
- 0883US6576499B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2001·Granted Jun 10, 2003·25 cites·3 claims
- 0981US6798070B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2000·Granted Sep 28, 2004·23 cites·8 claims
- 1080US5384952AMethod of connecting an integrated circuit chip to a substrateNEC CORP·Filed 1991·Granted Jan 31, 1995·67 cites·10 claims
- 1180US5302456AAnisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive materialNEC CORP·Filed 1992·Granted Apr 12, 1994·63 cites·19 claims
- 1279US5287208ALiquid crystal device with benzocyclobutene alignment layer and protective coating for electrodesNEC CORP·Filed 1992·Granted Feb 15, 1994·44 cites·4 claims
- 1377US5545281AMethod of bonding circuit boardsNEC CORP·Filed 1994·Granted Aug 13, 1996·50 cites·11 claims
- 1477US5483101AMultilayer printed circuit boardNEC CORP·Filed 1994·Granted Jan 9, 1996·53 cites·8 claims
- 1576US6466124B1Thin film resistor and method for forming the sameNEC CORP·Filed 2000·Granted Oct 15, 2002·24 cites·15 claims
- 1676US5000679ABurner with a cylindrical bodyNIPPON KOKAN KK·Filed 1989·Granted Mar 19, 1991·18 cites·13 claims
- 1775US5318651AMethod of bonding circuit boardsNEC CORP·Filed 1992·Granted Jun 7, 1994·46 cites·1 claims
- 1874US6030914AZirconia fine powder and method for its productionTOSOH CORP·Filed 1997·Granted Feb 29, 2000·36 cites·3 claims
- 1971US6042682AMethod of thermocompression bonding a supporting substrate to a semiconductor bare chipNEC CORP·Filed 1998·Granted Mar 28, 2000·24 cites·34 claims
- 2069US6674016B2Electronic componentNITTO DENKO CORP·Filed 2002·Granted Jan 6, 2004·15 cites·11 claims
- 2166US7585699B2Semiconductor package board using a metal baseNEC CORP·Filed 2006·Granted Sep 8, 2009·2 cites·19 claims
- 2265US7266669B2File system with file management function and file management methodTOSHIBA SOLUTIONS CORP·Filed 2005·Granted Sep 4, 2007·9 cites·17 claims
- 2365US5972739AMethod of manufacturing a tab semiconductor deviceNEC CORP·Filed 1998·Granted Oct 26, 1999·33 cites·20 claims
- 2462US4475973AMethod for production of a fluid separation moduleNITTO ELECTRIC IND CO·Filed 1982·Granted Oct 9, 1984·21 cites·6 claims
- 2560US12391621B2Sintered body, powder and method for producing the sameTOSOH CORP·Filed 2020·Granted Aug 19, 2025·0 cites·19 claims
- 2660US4969815ABurnerNIPPON KOKAN KK·Filed 1989·Granted Nov 13, 1990·11 cites·41 claims
- 2759US2024409471A1Powder and method for producing the sameTOSOH CORP·Filed 2022·Application pending·0 cites
- 2857US8997713B2Throttle body configured to provide turbulent air flow to a combustion chamber of an engine, and engine including sameNAKAJIMA YASUAKI·Filed 2012·Granted Apr 7, 2015·2 cites·4 claims
- 2956US6331811B2Thin-film resistor, wiring substrate, and method for manufacturing the sameNEC CORP·Filed 1999·Granted Dec 18, 2001·15 cites·18 claims
- 3054US4614043AApparatus for designing a couplerOSAKA SHIPBUILDING·Filed 1984·Granted Sep 30, 1986·15 cites·4 claims
- 3153US7352069B2Electronic component unitNITTO DENKO CORP·Filed 2003·Granted Apr 1, 2008·5 cites·11 claims
- 3253US5712506ASemiconductor device with passivation layer of benzocyclobutene polymer and silicon powderNEC CORP·Filed 1995·Granted Jan 27, 1998·18 cites·13 claims
- 3352US4993939ABurner with a cylindrical bodyNIPPON KOKAN KK·Filed 1989·Granted Feb 19, 1991·8 cites·5 claims
- 3450US5372872AMultilayer printed circuit boardNEC CORP·Filed 1993·Granted Dec 13, 1994·13 cites·8 claims
- 3549US10466672B2Operation plan creation device, operation plan creation method, and operation plan creation programMITSUBISHI HEAVY IND LTD·Filed 2014·Granted Nov 5, 2019·0 cites·4 claims
- 3649US7829199B2Solder, and mounted components using the sameNEC CORP·Filed 2005·Granted Nov 9, 2010·0 cites·6 claims
- 3748US4971552ABurnerNIPPON KOKAN KK·Filed 1989·Granted Nov 20, 1990·6 cites·21 claims
- 3847US6444403B1Resin laminated wiring sheet, wiring structure using the same, and production method thereofNEC CORP·Filed 2000·Granted Sep 3, 2002·2 cites·3 claims
- 3947US6204565B1Semiconductor carrier and method for manufacturing the sameNEC CORP·Filed 1999·Granted Mar 20, 2001·13 cites·5 claims
- 4047US5889233AMultilayer wiring structureNEC CORP·Filed 1996·Granted Mar 30, 1999·14 cites·6 claims
- 4146US6515869B2Supporting substrate for a semiconductor bare chipNEC CORP·Filed 2000·Granted Feb 4, 2003·1 cites·12 claims
- 4244US6156414ACarrier film and process for producing the sameNEC CORP·Filed 1998·Granted Dec 5, 2000·9 cites·3 claims
- 4344US2001011111A1Molded resin composition exhibiting good adhesion to conductive material on a surfaceNEC CORP·Filed 2001·Application pending·0 cites
- 4443US2005098875A1Semiconductor package board using a metal baseNEC CORP·Filed 2004·Application pending·0 cites
- 4542US6150074AMethod of forming electrically conductive wiring patternNEC CORP·Filed 1998·Granted Nov 21, 2000·9 cites·44 claims
- 4640US2002030577A1Thin-film resistor, wiring substrate, and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 4740US2002020836A1Thin film capacitor avoiding short circuit between electrodesNEC CORP·Filed 2001·Application pending·0 cites
- 4839US6333136B1Carrier film and process for producing the sameNEC CORP·Filed 2000·Granted Dec 25, 2001·0 cites·1 claims
- 4938US6232398B1Alkali or acid corrodible organic or composite particles in resin matrixNEC CORP·Filed 1997·Granted May 15, 2001·5 cites·9 claims
- 5038US2003064147A1Method for manufacturing flexible printed circuit and flexible printed circuit obtained in the methodNITTO DENKO CORP·Filed 2002·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →