Inventor · disambiguated record
Koichi Matsuno
Also filed as: MATSUNO KOICHI
53 granted patents·50 pending applications·250 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
103 records- 0199US11380707B2Three-dimensional memory device including backside trench support structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jul 5, 2022·9 cites·20 claims
- 0298US11856765B2Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Dec 26, 2023·6 cites·14 claims
- 0398US11387142B1Semiconductor device containing bit lines separated by air gaps and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jul 12, 2022·7 cites·20 claims
- 0497US11587920B2Bonded semiconductor die assembly containing through-stack via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Feb 21, 2023·4 cites·20 claims
- 0596US10727216B1Method for removing a bulk substrate from a bonded assembly of wafersSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jul 28, 2020·13 cites·20 claims
- 0695US11871580B2Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jan 9, 2024·3 cites·7 claims
- 0795US10985169B2Three-dimensional device with bonded structures including a support die and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 20, 2021·14 cites·15 claims
- 0895US7800155B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Sep 21, 2010·41 cites·9 claims
- 0992US9922991B2Semiconductor memory device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2016·Granted Mar 20, 2018·8 cites·13 claims
- 1091US6889043B2Method of controlling a communication terminal having a plurality of functions, communication terminal apparatus, communication control systemSONY CORP·Filed 2001·Granted May 3, 2005·55 cites·19 claims
- 1190US12457742B2Three-dimensional memory device including trench bridges and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·1 cites·11 claims
- 1290US7130631B2Method of controlling a communication terminal having a plurality of functions, communication terminal apparatus, communication control systemSONY CORP·Filed 2005·Granted Oct 31, 2006·16 cites·1 claims
- 1388US7402499B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2006·Granted Jul 22, 2008·14 cites·9 claims
- 1485US6987970B2Method of controlling a communication terminal having a plurality of functions, communication terminal apparatus, communication control systemSONY CORP·Filed 2005·Granted Jan 17, 2006·8 cites·1 claims
- 1578US9082866B2Semiconductor storage device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Jul 14, 2015·5 cites·12 claims
- 1678US7400010B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2006·Granted Jul 15, 2008·6 cites·5 claims
- 1776US10290649B2Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2017·Granted May 14, 2019·2 cites·21 claims
- 1875US8759177B2Pattern forming methodYANAI YOSHIHIRO·Filed 2012·Granted Jun 24, 2014·5 cites·20 claims
- 1975US8592978B2Method of fabricating semiconductor device and the semiconductor deviceMATSUNO KOICHI·Filed 2010·Granted Nov 26, 2013·3 cites·13 claims
- 2074US8592272B2Method of manufacturing non-volatile semiconductor memory deviceMATSUNO KOICHI·Filed 2012·Granted Nov 26, 2013·4 cites·20 claims
- 2174US7162240B2Method of controlling a communication terminal having a plurality of functions, communication terminal apparatus, communication control systemSONY CORP·Filed 2005·Granted Jan 9, 2007·3 cites·6 claims
- 2274US7139572B2Method of controlling a communication terminal having a plurality of functions, communication terminal apparatus, communication control systemSONY CORP·Filed 2005·Granted Nov 21, 2006·3 cites·1 claims
- 2372US2024179905A1Stairless three-dimensional memory device and method of making thereof by forming replacement word lines through memory openingsSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 2470US12243865B2Bonded semiconductor die assembly containing through-stack via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
- 2570US2024414917A1Memory device including word line contact strips and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 2667US2025380416A1Three-dimensional memory device with through-stack contact assemblies and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2765US6803622B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Oct 12, 2004·8 cites·11 claims
- 2865US2024276725A1Three-dimensional memory device with integrated contact and support structure and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2964US2024395710A1Three-dimensional memory device containing multi-level bridge support structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 3063US2025380424A1Three-dimensional memory device with laterally integrated access transistors and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 3163US2025014990A1Three-dimensional memory device with through-stack contact via structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 3262US12457743B2Three-dimensional memory device including trench bridges and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·0 cites·14 claims
- 3362US11127729B2Method for removing a bulk substrate from a bonded assembly of wafersSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Sep 21, 2021·0 cites·14 claims
- 3462US2025351348A1Three-dimensional semiconductor device containing core-bias electrode surrounded by vertical semiconductor channel and method of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 3562US2025081453A1Three-dimensional memory device with pillar shaped trench bridge structures and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 3662US2024373633A1Three-dimensional memory device with through-stack contact via structures and method of making the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3761US2024215243A1Three-dimensional memory device with through-stack contact via structures and method of making the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3861US2024334695A1Three-dimensional memory device containing composite dielectric isolation structure in a staircase region and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 3961US2025252998A1Three-dimensional memory device containing a dielectric support assembly with a dielectric connection plate and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 4061US2024373631A1Three-dimensional memory device with through-stack contact via structures and method of making the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4161US2025081458A1Three-dimensional memory device with pillar shaped trench bridge structures and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4261US2024258317A1Transistor circuits including fringeless transistors and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 4360US12133388B2Three-dimensional memory device with self-aligned etch stop rings for a source contact layer and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 29, 2024·0 cites·14 claims
- 4459US9219066B2Method of manufacturing semiconductor storage device and semiconductor storage deviceTOSHIBA KK·Filed 2013·Granted Dec 22, 2015·1 cites·7 claims
- 4559US8129816B2Semiconductor device and method of manufacturing the sameMATSUNO KOICHI·Filed 2008·Granted Mar 6, 2012·2 cites·12 claims
- 4659US2024371789A1Three-dimensional memory device containing trench support bridge structures and methods for manufacturing the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4759US2024274191A1Three-dimensional memory device with integrated contact and support structure and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 4859US2025126784A1Three-dimensional memory device including sloping word lines for stairless contact and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 4959US2025275134A1Stairless three-dimensional memory device with word line contact via structures located over support features and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 5059US2024237354A1Three-dimensional memory device with self-aligned word line contact via structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →