Inventor · disambiguated record
Koichi Niwa
Also filed as: FUJIMORI MASATOSHI · NIWA KOICHI
31 granted patents·728 citations·filing 1978–2000
97Inventor score
Top patents by PatentIndex Score
31 records- 0197US4704658AEvaporation cooling module for semiconductor devicesFUJITSU LTD·Filed 1986·Granted Nov 3, 1987·122 cites·24 claims
- 0284US4237606AMethod of manufacturing multilayer ceramic boardFUJITSU LTD·Filed 1978·Granted Dec 9, 1980·51 cites·15 claims
- 0382US6193905B1Immersion cooling coolantFUJITSU LTD·Filed 1995·Granted Feb 27, 2001·60 cites·6 claims
- 0480US4313026AMultilayer circuit boardsFUJITSU LTD·Filed 1979·Granted Jan 26, 1982·40 cites·13 claims
- 0579US5349499AImmersion cooling coolant and electronic device using this coolantFUJITSU LTD·Filed 1993·Granted Sep 20, 1994·53 cites·9 claims
- 0679US4642148AMethod for producing a multilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Feb 10, 1987·49 cites·7 claims
- 0777US4954480AMulti-layer superconducting circuit substrate and process for manufacturing sameFUJITSU LTD·Filed 1988·Granted Sep 4, 1990·49 cites·4 claims
- 0874US4504339AMethod for producing multilayered glass-ceramic structure with copper-based conductors thereinFUJITSU LTD·Filed 1983·Granted Mar 12, 1985·35 cites·14 claims
- 0971US6560435B1Electrophotographic image forming device having projections on a surface of an intermediate transfer bodyHITACHI LTD·Filed 2000·Granted May 6, 2003·13 cites·27 claims
- 1069US5593526AProcess for preparing a multi-layer wiring boardFUJITSU LTD·Filed 1994·Granted Jan 14, 1997·36 cites·25 claims
- 1163US4346516AMethod of forming a ceramic circuit substrateFUJITSU LTD·Filed 1981·Granted Aug 31, 1982·24 cites·19 claims
- 1262US5600420AImage transfer element in a color image forming apparatusHITACHI LTD·Filed 1994·Granted Feb 4, 1997·14 cites·12 claims
- 1362US5287620AProcess of producing multiple-layer glass-ceramic circuit boardFUJITSU LTD·Filed 1992·Granted Feb 22, 1994·30 cites·7 claims
- 1462US5038571AProduction and use of coolant in cryogenic devicesFUJITSU LTD·Filed 1989·Granted Aug 13, 1991·25 cites·38 claims
- 1555US4761325AMultilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Aug 2, 1988·18 cites·20 claims
- 1652US5081070ASuperconducting circuit board and paste adopted thereforFUJITSU LTD·Filed 1989·Granted Jan 14, 1992·17 cites·14 claims
- 1751US5443786AComposition for the formation of ceramic viasFUJITSU LTD·Filed 1990·Granted Aug 22, 1995·19 cites·7 claims
- 1847US5275889AMulti-layer wiring boardFUJITSU LTD·Filed 1991·Granted Jan 4, 1994·13 cites·9 claims
- 1947US5141917AMultilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting filmsFUJITSU LTD·Filed 1990·Granted Aug 25, 1992·7 cites·7 claims
- 2047US4460916ACeramic substrate with integrated circuit bonded thereonFUJITSU LTD·Filed 1982·Granted Jul 17, 1984·12 cites·1 claims
- 2144US5015314AMethod for production of ceramic circuit boardFUJITSU LTD·Filed 1990·Granted May 14, 1991·10 cites·3 claims
- 2243US4883843AImide bond-containing resins and flame retardants comprising said resinsDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1989·Granted Nov 28, 1989·5 cites·2 claims
- 2340US5049541AProcess for preparing superconductorFUJITSU LTD·Filed 1989·Granted Sep 17, 1991·6 cites·16 claims
- 2437US5306702AProcess for producing Bi-Pb-Sr-Ca-Cu-O superconducting filmsFUJITSU LTD·Filed 1991·Granted Apr 26, 1994·5 cites·12 claims
- 2537US5047477AMethod of producing imide bond-containing resins and flame retardants comprising said resinsDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1989·Granted Sep 10, 1991·3 cites·3 claims
- 2634US5072000AMethod of producing imide bond-containing compounds and flame retardants comprising such compoundsDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1989·Granted Dec 10, 1991·0 cites·2 claims
- 2733US5585332AProcess for preparing a perovskite Bi-containing superconductor filmFUJITSU LTD·Filed 1995·Granted Dec 17, 1996·3 cites·7 claims
- 2833US5286713AMethod for manufacturing an oxide superconducting circuit board by printingFUJITSU LTD·Filed 1993·Granted Feb 15, 1994·5 cites·24 claims
- 2932US5629269AProcess for forming oxide superconducting films with a plurality of metal buffer layersFUJITSU LTD·Filed 1994·Granted May 13, 1997·2 cites·20 claims
- 3030US5312803AProcess for producing Bi- and Pb-containing oxide superconducting wiring filmsFUJITSU LTD·Filed 1991·Granted May 17, 1994·1 cites·39 claims
- 3130US5086114AMethod of producing imide bond-containing resinsDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1990·Granted Feb 4, 1992·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →