Inventor · disambiguated record
Koushik Ramachandran
Also filed as: RAMACHANDRAN KOUSHIK
10 granted patents·6 pending applications·49 citations·filing 2016–2024
86Inventor score
Top patents by PatentIndex Score
16 records- 0197US11075453B1Microelectronics package with ultra-low-K dielectric region between stacked antenna elementsGLOBALFOUNDRIES US INC·Filed 2020·Granted Jul 27, 2021·9 cites·20 claims
- 0293US11804452B2Pic structure having barrier surrounding opening for optical element to prevent stress damageGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 31, 2023·8 cites·20 claims
- 0392US10598860B2Photonic die fan out package with edge fiber coupling interface and related methodsGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 24, 2020·10 cites·20 claims
- 0492US10438894B1Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devicesGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 8, 2019·13 cites·20 claims
- 0587US12135456B2Waveguide cores with a dual-trapezoidal shapeGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 5, 2024·1 cites·20 claims
- 0687US10409014B1PIC die packaging using magnetics to position optical elementGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 10, 2019·6 cites·15 claims
- 0783US11502400B2Microelectronics package with ultra-low-K dielectric region between stacked antenna elementsGLOBALFOUNDRIES US INC·Filed 2021·Granted Nov 15, 2022·1 cites·20 claims
- 0882US11828983B2Photonics chips including cavities with non-right-angle internal cornersGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 28, 2023·1 cites·20 claims
- 0963US12339494B2Edge couplers with a fine-alignment mechanismGLOBALFOUNDRIES US INC·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 1063US2024348005A1Laser chips attached to a photonics chip by multiple adhesivesGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1161US2024154384A1Cavity-mounted chips with multiple adhesivesGLOBALFOUNDRIES US INC·Filed 2022·Application pending·0 cites
- 1256US11502106B2Multi-layered substrates of semiconductor devicesGLOBALFOUNDRIES US INC·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 1355US2025164707A1Structures for a photonics chip that enable external communicationGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1452US2025334758A1Electro-optic bridge chips for chip-to-chip communicationGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 1552US2024356302A1Laser chips attached to a photonics chip by multiple anchorsGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1636US2018166356A1Fan-out circuit packaging with integrated lidGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →