Inventor · disambiguated record
Koji Taya
Also filed as: TAYA KOJI
23 granted patents·144 citations·filing 2005–2013
95Inventor score
Top patents by PatentIndex Score
23 records- 0193US7285848B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2005·Granted Oct 23, 2007·19 cites·10 claims
- 0291US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 0391US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 0486US7834470B2Semiconductor device and programming methodSPANSION LLC·Filed 2009·Granted Nov 16, 2010·9 cites·18 claims
- 0584US8097961B2Semiconductor device having a simplified stack and method for manufacturing thereofTANAKA JUNJI·Filed 2008·Granted Jan 17, 2012·12 cites·15 claims
- 0684US7786587B2Semiconductor device and method for manufacturing thereofSPANSION LLC·Filed 2008·Granted Aug 31, 2010·13 cites·10 claims
- 0782US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 0878US7566978B2Semiconductor device and programming methodSPANSION LLC·Filed 2007·Granted Jul 28, 2009·5 cites·16 claims
- 0977US7968990B2Semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jun 28, 2011·7 cites·11 claims
- 1070US8796864B2Flip chip bonded semiconductor device with shelfSPANSION LLC·Filed 2013·Granted Aug 5, 2014·2 cites·14 claims
- 1170US8772953B2Semiconductor device and programming methodTAYA KOJI·Filed 2009·Granted Jul 8, 2014·3 cites·24 claims
- 1270US7696616B2Stacked type semiconductor device and method of fabricating stacked type semiconductor deviceSPANSION LLC·Filed 2006·Granted Apr 13, 2010·4 cites·9 claims
- 1369US7642637B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jan 5, 2010·2 cites·8 claims
- 1468US8900928B2Semiconductor device and programming methodSPANSION LLC·Filed 2013·Granted Dec 2, 2014·1 cites·20 claims
- 1566US8486756B2Flip chip bonded semiconductor device with shelf and method of manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jul 16, 2013·3 cites·18 claims
- 1665US8530282B2Semiconductor device and programming methodTAYA KOJI·Filed 2010·Granted Sep 10, 2013·1 cites·18 claims
- 1763US7489029B2Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor deviceSPANSION LLC·Filed 2005·Granted Feb 10, 2009·1 cites·8 claims
- 1862US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 1956US9142440B2Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor deviceONODERA MASANORI·Filed 2008·Granted Sep 22, 2015·0 cites·18 claims
- 2052US7846771B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2008·Granted Dec 7, 2010·0 cites·2 claims
- 2150US8361857B2Semiconductor device having a simplified stack and method for manufacturing thereofSPANSION LLC·Filed 2011·Granted Jan 29, 2013·0 cites·5 claims
- 2247US7414305B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2006·Granted Aug 19, 2008·0 cites·15 claims
- 2344US8148771B2Semiconductor device and method to manufacture thereofHOSHINO MASATAKA·Filed 2010·Granted Apr 3, 2012·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →