Inventor · disambiguated record
Kohei Toyama
Also filed as: TOYAMA KOHEI
18 granted patents·4 pending applications·456 citations·filing 1991–2024
95Inventor score
Top patents by PatentIndex Score
22 records- 0191US11945415B2Vehicle-mounted sensor cleaning deviceDENSO CORP·Filed 2020·Granted Apr 2, 2024·2 cites·9 claims
- 0288US5269285AWire saw and slicing method using the sameSHINETSU HANDOTAI KK·Filed 1992·Granted Dec 14, 1993·64 cites·3 claims
- 0383US5937844AMethod for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicingSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 17, 1999·47 cites·14 claims
- 0481US5875769AMethod of slicing semiconductor single crystal ingotSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 2, 1999·46 cites·4 claims
- 0579US5778869AWire saw slicing apparatus and slicing method using the sameSHINETSU HANDOTAI KK·Filed 1996·Granted Jul 14, 1998·43 cites·21 claims
- 0678US6001265ARecovery of coolant and abrasive grains used in slicing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Dec 14, 1999·48 cites·14 claims
- 0774US6387809B2Method and apparatus for lapping or polishing semiconductor silicon single crystal waferSHINETSU HANDOTAI KK·Filed 1999·Granted May 14, 2002·42 cites·2 claims
- 0872US5830369ASystem for reusing oily slurry waste fluidSHINETSU HANDOTAI KK·Filed 1997·Granted Nov 3, 1998·32 cites·8 claims
- 0968US5810643AWire saw cutting method synchronizing workpiece feed speed with wire speedSHINETSU HANDOTAI KK·Filed 1996·Granted Sep 22, 1998·23 cites·11 claims
- 1068US2025028027A1Ranging deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1166US5944584AApparatus and method for chamfering wafer with loose abrasive grainsSHIN ESTU HANDOTAI CO LTD·Filed 1997·Granted Aug 31, 1999·27 cites·19 claims
- 1263US5947798AWire saw cutting apparatus synchronizing workpiece feed speed with wire speedSHINETSU HANDOTAI KK·Filed 1998·Granted Sep 7, 1999·19 cites·21 claims
- 1362US2024248178A1Vehicle mounting structure for ranging device, and ranging deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1457US5927131AMethod of manufacturing wire for use in a wire saw and wire for use in a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Jul 27, 1999·17 cites·11 claims
- 1556US5693596ACutting fluid, method for production thereof, and method for cutting ingotSHINETSU HANDOTAI KK·Filed 1995·Granted Dec 2, 1997·15 cites·8 claims
- 1656US2025044583A1Optical deflector and optical scanning deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1753US5313741AMethod of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine thereinSHINETSU HANDOTAI KK·Filed 1991·Granted May 24, 1994·11 cites·14 claims
- 1851US12339398B2Lidar apparatusDENSO CORP·Filed 2020·Granted Jun 24, 2025·0 cites·7 claims
- 1942US12164061B2Lidar deviceDENSO CORP·Filed 2020·Granted Dec 10, 2024·0 cites·8 claims
- 2042US5899744AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted May 4, 1999·12 cites·6 claims
- 2140US5226403AMethod of using an id saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the methodSHINETSU HANDOTAI KK·Filed 1991·Granted Jul 13, 1993·8 cites·7 claims
- 2231US2002153526A1Packaging bag for semiconductor wafer and method of packaging semiconductor wafer using the packaging bagFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →