Inventor · disambiguated record
Kohei Tsujimoto
Also filed as: TSUJIMOTO KOHEI
3 granted patents·5 pending applications·5 citations·filing 2015–2024
56Inventor score
Files withDISCO CORP8
Top patents by PatentIndex Score
8 records- 0174US9786509B2Wafer processing methodDISCO CORP·Filed 2015·Granted Oct 10, 2017·3 cites·1 claims
- 0273US10115578B2Wafer and method of processing waferDISCO CORP·Filed 2017·Granted Oct 30, 2018·2 cites·2 claims
- 0368US2024261926A1Method of shaping holding surface of chuck tableDISCO CORP·Filed 2024·Application pending·0 cites
- 0455US2024058922A1Workpiece processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 0554US2023411180A1Method of handling waferDISCO CORP·Filed 2023·Application pending·0 cites
- 0653US2023302599A1Grinding method of waferDISCO CORP·Filed 2023·Application pending·0 cites
- 0751US2024153777A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 0841US12255086B2Processing method of waferDISCO CORP·Filed 2020·Granted Mar 18, 2025·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →