Inventor · disambiguated record
Koichi Yatsuda
Also filed as: YATSUDA KOICHI
20 granted patents·9 pending applications·634 citations·filing 1997–2020
93Inventor score
Top patents by PatentIndex Score
29 records- 0198US6156151APlasma processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Dec 5, 2000·498 cites·20 claims
- 0296US8641916B2Plasma etching apparatus, plasma etching method and storage mediumYATSUDA KOICHI·Filed 2010·Granted Feb 4, 2014·67 cites·19 claims
- 0394US8685267B2Substrate processing methodYATSUDA KOICHI·Filed 2011·Granted Apr 1, 2014·43 cites·15 claims
- 0486US7871908B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2009·Granted Jan 18, 2011·11 cites·11 claims
- 0585US11557661B2Method for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2020·Granted Jan 17, 2023·1 cites·9 claims
- 0678US10325780B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2017·Granted Jun 18, 2019·2 cites·7 claims
- 0771US10593556B2Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Mar 17, 2020·1 cites·6 claims
- 0869US11171050B2Method for manufacturing a contact pad, method for manufacturing a semiconductor device using same, and semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Nov 9, 2021·1 cites·28 claims
- 0965US11056349B2Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 6, 2021·0 cites·4 claims
- 1065US9863466B2Sliding bearingTAIHO KOGYO CO LTD·Filed 2016·Granted Jan 9, 2018·1 cites·2 claims
- 1163US11495490B2Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2020·Granted Nov 8, 2022·0 cites·5 claims
- 1261US8198183B2Forming method of etching mask, control program and program storage mediumYATSUDA KOICHI·Filed 2008·Granted Jun 12, 2012·1 cites·1 claims
- 1357US6488863B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2001·Granted Dec 3, 2002·8 cites·20 claims
- 1456US11004684B2Forming method of hard maskTOKYO ELECTRON LTD·Filed 2019·Granted May 11, 2021·0 cites·4 claims
- 1555US10910259B2Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2018·Granted Feb 2, 2021·0 cites·8 claims
- 1655US2011104901A1Semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 1753US10224202B2Forming method of hard mask, forming apparatus of hard mask and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 1850US10840359B2Method of forming FinFET source/drain contactTOKYO ELECTRON LTD·Filed 2016·Granted Nov 17, 2020·0 cites·8 claims
- 1948US2009087990A1Manufacturing method, manufacturing apparatus, control program and program recording medium of semiconductor deviceTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2048US2009087991A1Manufacturing method, manufacturing apparatus, control program and program recording medium of semicontructor deviceTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2148US2009081565A1Method for forming etching mask, control program and program storage mediumTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2248US2012190206A1Semiconductor device manufacturing methodYATSUDA KOICHI·Filed 2012·Application pending·0 cites
- 2347US11120999B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2018·Granted Sep 14, 2021·0 cites·7 claims
- 2446US8114781B2Substrate processing method and substrate processing apparatusNISHIMURA EIICHI·Filed 2007·Granted Feb 14, 2012·0 cites·9 claims
- 2543US9879718B2Sliding bearing and method for manufacturing sliding bearingTAIHO KOGYO CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·8 claims
- 2638US2010220081A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 2738US2010300622A1Circular ring-shaped member for plasma process and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 2835US2005103441A1Etching method and plasma etching apparatusFiled 2004·Application pending·0 cites
- 2935US2015194441A1Method for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →