Inventor · disambiguated record
Kristopher J. Erickson
Also filed as: ERICKSON KRISTOPHER · ERICKSON KRISTOPHER J
41 granted patents·43 pending applications·32 citations·filing 2015–2024
95Inventor score
Top patents by PatentIndex Score
84 records- 0195US10647053B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted May 12, 2020·9 cites·15 claims
- 0292US11760010B2Forming three-dimensional (3D) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Sep 19, 2023·1 cites·12 claims
- 0390US11911825B2Fusing electronic components into three-dimensional objects via additive manufacturing processesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Feb 27, 2024·3 cites·5 claims
- 0488US11396129B2Increasing electrical conductivity at selected locations of a 3D objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jul 26, 2022·2 cites·15 claims
- 0586US11318532B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 3, 2022·2 cites·13 claims
- 0685US10919217B2Three-dimensional (3D) printing build material compositionHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Feb 16, 2021·3 cites·18 claims
- 0784US2024375350A1Green body including a metal nanoparticle binderHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Application pending·0 cites
- 0883US12257624B2Powder bed materialsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Mar 25, 2025·0 cites·16 claims
- 0983US11511479B2Temperature control in 3D object formationHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Nov 29, 2022·2 cites·17 claims
- 1082US11311942B2Metal-connected particle articlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Apr 26, 2022·1 cites·10 claims
- 1182US2023373157A1Forming three-dimensional (3d) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 1281US12005641B2Green body including a metal nanoparticle binderHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jun 11, 2024·0 cites·15 claims
- 1381US11981084B2Lifecycle condition-based manufacturing alterationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 14, 2024·1 cites·15 claims
- 1481US11969945B2Automated handling based on part identifier and locationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Apr 30, 2024·1 cites·14 claims
- 1581US11008479B2Fusing agent including a tetraphenyldiamine-based dyeHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 18, 2021·2 cites·15 claims
- 1680US11338363B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted May 24, 2022·1 cites·16 claims
- 1780US2024351274A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Application pending·0 cites
- 1879US11904537B23D forming objects using high melting temperature polymersHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 1979US2024359402A1Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Application pending·0 cites
- 2078US11383301B2Metal-connected particle articlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jul 12, 2022·0 cites·9 claims
- 2177US11887177B2Part re-order based on part-specific sensor dataHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jan 30, 2024·1 cites·15 claims
- 2277US11840016B2Increasing electrical conductivity at selected locations of a 3D objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Dec 12, 2023·0 cites·13 claims
- 2377US2023191696A1Composition including a high melt temperature build materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 2477US2023347585A1Three dimensional (3d) printing methodHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 2577US2023264414A1Forming three-dimensional (3d) printed electronicsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 2676US11167374B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Nov 9, 2021·1 cites·10 claims
- 2776US10974322B2Photonic fusingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 13, 2021·1 cites·14 claims
- 2876US2023264415A1Additive manufacturing of three-dimensional objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 2976US2025215159A1Conductive urethane acrylate and silicone hybrid electrodes and methods of using the sameMETA PLATFORMS TECH LLC·Filed 2024·Application pending·0 cites
- 3074US10781228B2Fusing agent including a metal bis(dithiolene) complexHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Sep 22, 2020·1 cites·15 claims
- 3171US2019160532A1Metal-connected particle articlesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 3270US12017406B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 25, 2024·0 cites·12 claims
- 3370US11685114B2Additive manufacturing of three-dimensional objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 27, 2023·0 cites·10 claims
- 3470US2021220913A1Photonic fusingHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 3569US11845128B2Powder bed materialsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Dec 19, 2023·0 cites·19 claims
- 3669US11413687B2Green body including a metal nanoparticle binderHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 16, 2022·0 cites·14 claims
- 3768US12036734B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jul 16, 2024·0 cites·9 claims
- 3867US2024092987A1Conductive elastomeric foam materials and methods of useMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 3965US2025145844A1Thiol-based small molecule binders for improving the metal-silicone interface for stretchable electronicsMETA PLATFORMS TECH LLC·Filed 2024·Application pending·0 cites
- 4062US2019134898A1Forming three-dimensional (3d) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 4161US11801631B2Three-dimensional printed partHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 31, 2023·0 cites·9 claims
- 4261US11413815B23D forming objects using high melting temperature polymersHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 16, 2022·0 cites·17 claims
- 4361US11338510B2Build material distributing cylindersHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 24, 2022·0 cites·20 claims
- 4460US11648731B2Forming three-dimensional (3D) printed electronicsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted May 16, 2023·0 cites·13 claims
- 4559US12128612B2Binder agentHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Oct 29, 2024·0 cites·11 claims
- 4659US11845129B2Brown body including a metal nanoparticle binderHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Dec 19, 2023·0 cites·15 claims
- 4759US11697153B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jul 11, 2023·0 cites·18 claims
- 4857US11822995B2Resonator-based object pose determinationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 21, 2023·0 cites·15 claims
- 4957US11759996B2Surface feature formation for three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Sep 19, 2023·0 cites·20 claims
- 5057US10889057B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jan 12, 2021·0 cites·15 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →