Inventor · disambiguated record
Krishna Seshan
Also filed as: SESHAN KRISHNA
55 granted patents·7 pending applications·1,591 citations·filing 1989–2007
99Inventor score
Top patents by PatentIndex Score
62 records- 0196US7034402B1Device with segmented ball limiting metallurgyINTEL CORP·Filed 2000·Granted Apr 25, 2006·96 cites·14 claims
- 0296US6521996B1Ball limiting metallurgy for input/outputs and methods of fabricationINTEL CORP·Filed 2000·Granted Feb 18, 2003·82 cites·14 claims
- 0393US6162652AProcess for sort testing C4 bumped wafersINTEL CORP·Filed 1997·Granted Dec 19, 2000·177 cites·16 claims
- 0492US7033923B2Method of forming segmented ball limiting metallurgyINTEL CORP·Filed 2005·Granted Apr 25, 2006·20 cites·10 claims
- 0590US6459573B1Mobile computer having a housing with openings for coolingINTEL CORP·Filed 2000·Granted Oct 1, 2002·63 cites·15 claims
- 0689US6377457B1Electronic assembly and cooling thereofINTEL CORP·Filed 2000·Granted Apr 23, 2002·76 cites·20 claims
- 0787US7314819B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2005·Granted Jan 1, 2008·15 cites·23 claims
- 0886US5298784AElectrically programmable antifuse using metal penetration of a junctionIBM·Filed 1992·Granted Mar 29, 1994·87 cites·20 claims
- 0985US7425458B2Selectable decoupling capacitors for integrated circuits and associated methodsINTEL CORP·Filed 2005·Granted Sep 16, 2008·10 cites·8 claims
- 1085US6876053B1Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 1999·Granted Apr 5, 2005·61 cites·7 claims
- 1185US6577502B1Mobile computer having a housing with openings for coolingINTEL CORP·Filed 2000·Granted Jun 10, 2003·42 cites·19 claims
- 1283US6352940B1Semiconductor passivation deposition process for interfacial adhesionINTEL CORP·Filed 1998·Granted Mar 5, 2002·65 cites·22 claims
- 1381US6937458B2Selectable decoupling capacitors for integrated circuit and methods of useINTEL CORP·Filed 2003·Granted Aug 30, 2005·18 cites·17 claims
- 1481US6480385B2Electronic assembly and cooling thereofINTEL CORP·Filed 2001·Granted Nov 12, 2002·29 cites·18 claims
- 1580US6137155APlanar guard ringINTEL CORP·Filed 1997·Granted Oct 24, 2000·51 cites·11 claims
- 1678US7410858B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2006·Granted Aug 12, 2008·6 cites·24 claims
- 1778US6163065AEnergy-absorbing stable guard ringINTEL CORP·Filed 1997·Granted Dec 19, 2000·54 cites·16 claims
- 1877US6046101APassivation technology combining improved adhesion in passivation and a scribe street without passivationINTEL CORP·Filed 1997·Granted Apr 4, 2000·57 cites·2 claims
- 1976US7960831B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2007·Granted Jun 14, 2011·7 cites·23 claims
- 2076US6515358B1Integrated passivation process, probe geometry and probing processINTEL CORP·Filed 2000·Granted Feb 4, 2003·34 cites·17 claims
- 2174US6090650AMethod to reduce timing skews in I/O circuits and clock drivers caused by fabrication process tolerancesINTEL CORP·Filed 1997·Granted Jul 18, 2000·29 cites·4 claims
- 2274US5585663ASelf cooling electrically programmable fuseIBM·Filed 1995·Granted Dec 17, 1996·40 cites·10 claims
- 2373US7411269B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2005·Granted Aug 12, 2008·4 cites·24 claims
- 2473US6376899B1Planar guard ringINTEL CORP·Filed 2000·Granted Apr 23, 2002·16 cites·6 claims
- 2573US5622892AMethod of making a self cooling electrically programmable fuseIBM·Filed 1995·Granted Apr 22, 1997·37 cites·11 claims
- 2672US5154514AOn-chip temperature sensor utilizing a Schottky barrier diode structureIBM·Filed 1991·Granted Oct 13, 1992·37 cites·14 claims
- 2771US7012304B1Diode and transistor design for high speed I/OINTEL CORP·Filed 2000·Granted Mar 14, 2006·14 cites·10 claims
- 2868US6552425B1Integrated circuit packageINTEL CORP·Filed 1998·Granted Apr 22, 2003·34 cites·46 claims
- 2968US5444287AThermally activated noise immune fuseIBM·Filed 1994·Granted Aug 22, 1995·32 cites·19 claims
- 3067US6734544B2Integrated circuit packageINTEL CORP·Filed 2003·Granted May 11, 2004·14 cites·26 claims
- 3167US6357330B1Method and apparatus for cutting a waferINTEL CORP·Filed 1999·Granted Mar 19, 2002·27 cites·12 claims
- 3266US5213249AUltrasonic adhesion/dehesion monitoring apparatus with power feedback measuring meansIBM·Filed 1992·Granted May 25, 1993·35 cites·5 claims
- 3365US6715663B2Wire-bond process flow for copper metal-six, structures achieved thereby, and testing methodINTEL CORP·Filed 2002·Granted Apr 6, 2004·11 cites·13 claims
- 3464US6646324B1Method and apparatus for a linearized output driver and terminatorINTEL CORP·Filed 2000·Granted Nov 11, 2003·10 cites·9 claims
- 3562US6914658B2Method for fabricating a moat around an active pixel area of a microelectronic image projection deviceINTEL CORP·Filed 2002·Granted Jul 5, 2005·11 cites·7 claims
- 3662US6686659B2Selectable decoupling capacitors for integrated circuit and methods of useINTEL CORP·Filed 2001·Granted Feb 3, 2004·7 cites·30 claims
- 3758US6137143ADiode and transistor design for high speed I/OINTEL CORP·Filed 1998·Granted Oct 24, 2000·14 cites·19 claims
- 3858US5614440AMethod of forming a thermally activated noise immune fuseIBM·Filed 1995·Granted Mar 25, 1997·20 cites·18 claims
- 3957US6930379B2Power gridding schemeINTEL CORP·Filed 2003·Granted Aug 16, 2005·5 cites·9 claims
- 4055US7202568B2Semiconductor passivation deposition process for interfacial adhesionINTEL CORP·Filed 2001·Granted Apr 10, 2007·4 cites·10 claims
- 4155US6143668AKLXX technology with integrated passivation process, probe geometry and probing processINTEL CORP·Filed 1997·Granted Nov 7, 2000·18 cites·15 claims
- 4255US5170929AUltrasonic adhesion/dehesion monitoring apparatus with acoustic transducer meansIBM·Filed 1992·Granted Dec 15, 1992·22 cites·10 claims
- 4354US5504434AInstrument for the measurement of electrical characteristics during manufacturing processesIBM·Filed 1995·Granted Apr 2, 1996·18 cites·26 claims
- 4452US6043551AMetal locking structures to prevent a passivation layer from delaminatingINTEL CORP·Filed 1997·Granted Mar 28, 2000·17 cites·29 claims
- 4551US6979896B2Power gridding schemeINTEL CORP·Filed 2001·Granted Dec 27, 2005·3 cites·14 claims
- 4651US5977639AMetal staples to prevent interlayer delaminationINTEL CORP·Filed 1997·Granted Nov 2, 1999·16 cites·20 claims
- 4750US4962294AMethod and apparatus for causing an open circuit in a conductive lineIBM·Filed 1989·Granted Oct 9, 1990·17 cites·36 claims
- 4849US7511370B2Power gridding schemeINTEL CORP·Filed 2005·Granted Mar 31, 2009·0 cites·8 claims
- 4949US2007013023A1Isolation structure configurations for modifying stresses in semiconductor devicesMA QING·Filed 2006·Application pending·0 cites
- 5048US2006131748A1Ball limiting metallurgy split into segmentsSESHAN KRISHNA·Filed 2006·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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