Inventor · disambiguated record

Krishnan Shrinivasan

Also filed as: SHRINIVASAN KRISHNAN

20 granted patents·2 pending applications·1,802 citations·filing 1999–2015

97Inventor score

Technology areasH10P H10W

Files withNOVELLUS SYSTEMS INC16 SHRINIVASAN KRISHNAN3 GASONICS INTERNAT CORP1 HAVERKAMP JASON1 KELMAN MAXIM1

Top patents by PatentIndex Score

22 records

0196US7327948B1Cast pedestal with heating element and coaxial heat exchangerNOVELLUS SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·582 cites·22 claims
0296US6848455B1Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing speciesNOVELLUS SYSTEMS INC·Filed 2002·Granted Feb 1, 2005·113 cites·28 claims
0396US6848458B1Apparatus and methods for processing semiconductor substrates using supercritical fluidsNOVELLUS SYSTEMS INC·Filed 2002·Granted Feb 1, 2005·162 cites·59 claims
0495US8629068B1Multi-station sequential curing of dielectric filmsSHRINIVASAN KRISHNAN·Filed 2013·Granted Jan 14, 2014·25 cites·3 claims
0595US8454750B1Multi-station sequential curing of dielectric filmsSHRINIVASAN KRISHNAN·Filed 2007·Granted Jun 4, 2013·37 cites·22 claims
0695US7503334B1Apparatus and methods for processing semiconductor substrates using supercritical fluidsNOVELLUS SYSTEMS INC·Filed 2005·Granted Mar 17, 2009·49 cites·13 claims
0794US7941039B1Pedestal heat transfer and temperature controlNOVELLUS SYSTEMS INC·Filed 2007·Granted May 10, 2011·36 cites·15 claims
0894US6764552B1Supercritical solutions for cleaning photoresist and post-etch residue from low-k materialsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 20, 2004·149 cites·25 claims
0994US6550484B1Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processingNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·91 cites·39 claims
1093US6228563B1Method and apparatus for removing post-etch residues and other adherent matricesGASONICS INTERNAT CORP·Filed 1999·Granted May 8, 2001·218 cites·20 claims
1192US6333268B1Method and apparatus for removing post-etch residues and other adherent matricesNOVELLUS SYSTEMS INC·Filed 2000·Granted Dec 25, 2001·117 cites·10 claims
1291US8980769B1Multi-station sequential curing of dielectric filmsHAVERKAMP JASON·Filed 2007·Granted Mar 17, 2015·19 cites·16 claims
1391US6800142B1Method for removing photoresist and post-etch residue using activated peroxide followed by supercritical fluid treatmentNOVELLUS SYSTEMS INC·Filed 2002·Granted Oct 5, 2004·57 cites·46 claims
1491US6563092B1Measurement of substrate temperature in a process chamber using non-contact filtered infrared pyrometryNOVELLUS SYSTEMS INC·Filed 2001·Granted May 13, 2003·73 cites·28 claims
1588US8951348B1Single-chamber sequential curing of semiconductor wafersSHRINIVASAN KRISHNAN·Filed 2012·Granted Feb 10, 2015·8 cites·20 claims
1687US8889233B1Method for reducing stress in porous dielectric filmsKELMAN MAXIM·Filed 2006·Granted Nov 18, 2014·16 cites·26 claims
1783US9873946B2Multi-station sequential curing of dielectric filmsNOVELLUS SYSTEMS INC·Filed 2015·Granted Jan 23, 2018·3 cites·18 claims
1882US9835388B2Systems for uniform heat transfer including adaptive portionsNOVELLUS SYSTEMS INC·Filed 2012·Granted Dec 5, 2017·8 cites·11 claims
1975US6905556B1Method and apparatus for using surfactants in supercritical fluid processing of wafersNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 14, 2005·19 cites·12 claims
2074US7105061B1Method and apparatus for sealing substrate load port in a high pressure reactorNOVELLUS SYSTEMS INC·Filed 2001·Granted Sep 12, 2006·20 cites·10 claims
2154US2014080324A1Multi-station sequential curing of dielectric filmsNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
2238US2008264443A1Apparatus and methods for increasing the rate of solute concentration evolution in a supercritical process chamberNOVELLUS SYSTEMS INC·Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →