Inventor · disambiguated record
Kuo-Chin Chang
Also filed as: CHANG KUO-CHIN
32 granted patents·35 pending applications·162 citations·filing 2002–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47TAIWAN SEMICONDUCTOR MFG7CHANG KUO-CHIN4LU SZU WEI2LIN TSUNG-SHU1
Top patents by PatentIndex Score
67 records- 0198US7932601B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Apr 26, 2011·59 cites·20 claims
- 0293US11145564B2Multi-layer passivation structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·9 cites·20 claims
- 0393US7804177B2Silicon-based thin substrate and packaging schemesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 28, 2010·31 cites·11 claims
- 0491US7820543B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 26, 2010·18 cites·10 claims
- 0590US11222859B2Semiconductor device structure with bonding pad and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0688US10861810B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·5 cites·20 claims
- 0784US8492263B2Protected solder ball joints in wafer level chip-scale packagingWANG CHUNG YU·Filed 2007·Granted Jul 23, 2013·11 cites·13 claims
- 0883US2025364461A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0983US2025357388A1Methods of forming mimcap corner structures in the keep-out zones of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1081US9136211B2Protected solder ball joints in wafer level chip-scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·5 cites·19 claims
- 1180US11189538B2Semiconductor structure with polyimide packaging and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·3 cites·20 claims
- 1279US12476211B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 1379US2025364473A1High-density microbump arrays with enhanced adhesion and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1476US7271480B2Constraint stiffener designTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 18, 2007·7 cites·22 claims
- 1575US8976529B2Lid design for reliability enhancement in flip chip packageLIN WEN-YI·Filed 2011·Granted Mar 10, 2015·4 cites·20 claims
- 1675US2025343084A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1775US2025351303A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1874US2025357270A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1973US2025349657A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2072US2025336768A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2172US2025343103A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2272US2025336769A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2371US2025210420A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2471US2024371715A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2570US2025227884A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2669US12482766B2MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 2769US11127704B2Semiconductor device with bump structure and method of making semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 21, 2021·1 cites·20 claims
- 2869US11018099B2Semiconductor structure having a conductive bump with a plurality of bump segmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 25, 2021·2 cites·20 claims
- 2969US2024120277A1Chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3068US12021048B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3168US8174129B2Silicon-based thin substrate and packaging schemesLU SZU WEI·Filed 2010·Granted May 8, 2012·2 cites·20 claims
- 3268US2025201668A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3368US2025201652A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3468US2025210458A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3567US2025218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3667US2025201658A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3766US11532583B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3865US12094792B2Package structure having lid with protrusion and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 3965US11380639B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 4064US2023107847A1High-density microbump arrays with enhanced adhesion and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4162US12009327B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4261US11855022B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4361US8704383B2Silicon-based thin substrate and packaging schemesLU SZU-WEI·Filed 2012·Granted Apr 22, 2014·1 cites·22 claims
- 4459US8519535B2Method and structure for controlling package warpageLIN TSUNG-SHU·Filed 2011·Granted Aug 27, 2013·1 cites·13 claims
- 4558US2004193533A1Project bidding transaction management system and methodFiled 2004·Application pending·0 cites
- 4656US2025221310A1Adaptive liquid cooling system for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4756US2025372475A1Heat-Dissipating Lid ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4856US2025349663A1Heat spreader structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4956US2025351293A1Dynamic liquid cooling for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5055US11495556B2Semiconductor structure having counductive bump with tapered portions and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →