Inventor · disambiguated record
Kuan-Neng Chen
Also filed as: CHEN KUAN-NENG
54 granted patents·14 pending applications·450 citations·filing 1992–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0196US8405279B2Coupling piezoelectric material generated stresses to devices formed in integrated circuitsELMEGREEN BRUCE G·Filed 2012·Granted Mar 26, 2013·23 cites·27 claims
- 0295US7772582B2Four-terminal reconfigurable devicesIBM·Filed 2007·Granted Aug 10, 2010·28 cites·4 claims
- 0394US8878193B2Graphene channel-based devices and methods for fabrication thereofIBM·Filed 2013·Granted Nov 4, 2014·13 cites·10 claims
- 0494US7307003B2Method of forming a multi-layer semiconductor structure incorporating a processing handle memberMASSACHUSETTS INST TECHNOLOGY·Filed 2003·Granted Dec 11, 2007·101 cites·45 claims
- 0592US8900918B2Graphene channel-based devices and methods for fabrication thereofIBM·Filed 2013·Granted Dec 2, 2014·10 cites·13 claims
- 0692US8426921B2Three-dimensional integrated circuits and techniques for fabrication thereofASSEFA SOLOMON·Filed 2011·Granted Apr 23, 2013·16 cites·13 claims
- 0792US8129811B2Techniques for three-dimensional circuit integrationASSEFA SOLOMON·Filed 2011·Granted Mar 6, 2012·15 cites·12 claims
- 0892US7897428B2Three-dimensional integrated circuits and techniques for fabrication thereofIBM·Filed 2008·Granted Mar 1, 2011·20 cites·12 claims
- 0991US8617689B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedCHEN KUAN-NENG·Filed 2012·Granted Dec 31, 2013·10 cites·9 claims
- 1091US8247947B2Coupling piezoelectric material generated stresses to devices formed in integrated circuitsELMEGREEN BRUCE G·Filed 2009·Granted Aug 21, 2012·18 cites·22 claims
- 1190US9496238B2Sloped bonding structure for semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Nov 15, 2016·10 cites·19 claims
- 1290US8455297B1Method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technologyAVOURIS PHAEDON·Filed 2010·Granted Jun 4, 2013·10 cites·23 claims
- 1389US8445320B2Graphene channel-based devices and methods for fabrication thereofAVOURIS PHAEDON·Filed 2010·Granted May 21, 2013·8 cites·9 claims
- 1489US7969770B2Programmable via devices in back end of line levelIBM·Filed 2007·Granted Jun 28, 2011·13 cites·19 claims
- 1589US7927911B2Wafer bonded access device for multi-layer phase change memory using lock-and-key alignmentIBM·Filed 2009·Granted Apr 19, 2011·17 cites·23 claims
- 1688US7955887B2Techniques for three-dimensional circuit integrationIBM·Filed 2008·Granted Jun 7, 2011·12 cites·11 claims
- 1787US7659534B2Programmable via devices with air gap isolationIBM·Filed 2007·Granted Feb 9, 2010·12 cites·21 claims
- 1887US7579616B2Four-terminal programmable via-containing structure and method of fabricating sameIBM·Filed 2007·Granted Aug 25, 2009·16 cites·20 claims
- 1986US7608851B2Switch array circuit and system using programmable via structures with phase change materialsIBM·Filed 2007·Granted Oct 27, 2009·12 cites·17 claims
- 2085US7683478B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Mar 23, 2010·9 cites·3 claims
- 2184US9984993B2Bonding structure for semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR INC·Filed 2016·Granted May 29, 2018·8 cites·18 claims
- 2284US8076177B2Scalable transfer-join bonding lock-and-key structuresCHEN KUAN-NENG·Filed 2010·Granted Dec 13, 2011·7 cites·20 claims
- 2383US8653641B2Integrated circuit deviceCHEN KUAN-NENG·Filed 2012·Granted Feb 18, 2014·7 cites·10 claims
- 2480US8241995B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectricCHEN KUAN-NENG·Filed 2006·Granted Aug 14, 2012·7 cites·18 claims
- 2580US7687309B2CMOS-process-compatible programmable via deviceIBM·Filed 2007·Granted Mar 30, 2010·7 cites·3 claims
- 2677US9373564B2Semiconductor device, manufacturing method and stacking structure thereofIND TECH RES INST·Filed 2015·Granted Jun 21, 2016·3 cites·11 claims
- 2776US2025366176A1Three dimensional integrated circuit and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2874US8053752B2Four-terminal reconfigurable devicesIBM·Filed 2011·Granted Nov 8, 2011·2 cites·7 claims
- 2973US7880157B2Four-terminal reconfigurable devicesIBM·Filed 2009·Granted Feb 1, 2011·4 cites·17 claims
- 3073US7811933B2CMOS-process-compatible programmable via deviceIBM·Filed 2010·Granted Oct 12, 2010·2 cites·4 claims
- 3172US12451589B2Antenna package and method for manufacturing an antenna packageTRON FUTURE TECH INC·Filed 2023·Granted Oct 21, 2025·0 cites·16 claims
- 3272US8951837B2Submicron connection layer and method for using the same to connect wafersCHEN KUAN-NENG·Filed 2012·Granted Feb 10, 2015·3 cites·17 claims
- 3371US8168542B2Methods of forming tubular objectsCHEN KUAN-NENG·Filed 2008·Granted May 1, 2012·2 cites·19 claims
- 3471US7786596B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Aug 31, 2010·3 cites·5 claims
- 3568US8603862B2Precise-aligned lock-and-key bonding structuresCHEN KUAN-NENG·Filed 2010·Granted Dec 10, 2013·2 cites·8 claims
- 3668US7652278B2Programmable via structure and method of fabricating sameIBM·Filed 2006·Granted Jan 26, 2010·3 cites·20 claims
- 3766US8546952B2Electrical test structure applying 3D-ICS bonding technology for stacking error measurementCHEN KUAN-NENG·Filed 2011·Granted Oct 1, 2013·2 cites·13 claims
- 3865US8525144B2Programmable via devicesCHEN KUAN-NENG·Filed 2009·Granted Sep 3, 2013·2 cites·15 claims
- 3965US8012811B2Methods of forming features in integrated circuitsIBM·Filed 2008·Granted Sep 6, 2011·2 cites·18 claims
- 4064US8389967B2Programmable via devicesCHEN KUAN-NENG·Filed 2007·Granted Mar 5, 2013·2 cites·19 claims
- 4164US2025192095A1Semiconductor package and method for fabricating semiconductor packageTRON FUTURE TECH INC·Filed 2024·Application pending·0 cites
- 4263US8243507B2Programmable via devices in back end of line levelCHEN KUAN-NENG·Filed 2011·Granted Aug 14, 2012·1 cites·12 claims
- 4361US2023411388A1Three dimensional integrated circuit and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4461US2025379187A1Semiconductor device and method of manufacturing the sameNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2025·Application pending·0 cites
- 4557US7888164B2Programmable via structure and method of fabricating sameIBM·Filed 2009·Granted Feb 15, 2011·0 cites·17 claims
- 4656US12418103B2Antenna package structureTRON FUTURE TECH INC·Filed 2022·Granted Sep 16, 2025·0 cites·17 claims
- 4756US8927087B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedIBM·Filed 2013·Granted Jan 6, 2015·0 cites·14 claims
- 4856US8698165B2Graphene channel-based devices and methods for fabrication thereofIBM·Filed 2013·Granted Apr 15, 2014·0 cites·12 claims
- 4955US2009303786A1Switch array circuit and system using programmable via structures with phase change materialsIBM·Filed 2009·Application pending·0 cites
- 5054US2008268574A1Hermetic seal and reliable bonding structures for 3d applicationsIBM·Filed 2008·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kuan-Neng Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →