Inventor · disambiguated record
Kuo-Ching Chen
Also filed as: CHEN KUO-CHING
13 granted patents·4 pending applications·71 citations·filing 2000–2024
89Inventor score
Files withUNIMICRON TECHNOLOGY CORP8CHEN KUO-CHING3ASKEY COMPUTER CORP2VIA TECH INC2LEXTAR ELECTRONICS CORP1
Top patents by PatentIndex Score
17 records- 0182US11641713B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 2, 2023·1 cites·13 claims
- 0279US7233468B2Level shifter ESD protection circuit with power-on-sequence considerationNOVATEK MICROELECTRONICS CORP·Filed 2005·Granted Jun 19, 2007·11 cites·27 claims
- 0374US7999195B2Circuit board having isolation cover and assembling method thereofASKEY COMPUTER CORP·Filed 2008·Granted Aug 16, 2011·9 cites·16 claims
- 0470US7689732B2Method for improving flexibility of arbitration of direct memory access (DMA) engines requesting access to shared DMA channelsVIA TECH INC·Filed 2006·Granted Mar 30, 2010·8 cites·18 claims
- 0569US8049114B2Package substrate with a cavity, semiconductor package and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Nov 1, 2011·6 cites·4 claims
- 0667US7012926B2Packet receiving method on a network with parallel and multiplexing capabilityVIA TECH INC·Filed 2000·Granted Mar 14, 2006·14 cites·17 claims
- 0766US12414235B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·0 cites·10 claims
- 0863US12396100B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 0963USD687788SLight emitting diode moduleCHEN KUO-CHING·Filed 2012·Granted Aug 13, 2013·18 cites·1 claims
- 1062US8106302B2Circuit board of communication product and manufacturing method thereofCHEN KUO-CHING·Filed 2008·Granted Jan 31, 2012·3 cites·13 claims
- 1159US2025365865A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1256US7958625B2Assembly deviceASKEY COMPUTER CORP·Filed 2009·Granted Jun 14, 2011·1 cites·20 claims
- 1355US2025040051A1Capacitive element, circuit carrier having the same and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1452US11488900B2Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 1551US11483925B2Circuit board and manufacture method of the circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 25, 2022·0 cites·6 claims
- 1645US2014321110A1Light tube deviceLEXTAR ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1739US2010206619A1Package substrate strucutre with cavity and method for making the sameCHEN KUO-CHING·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →