Inventor · disambiguated record
Kuang-Chih Cheng
Also filed as: CHENG KUANG-CHIH
7 granted patents·3 pending applications·88 citations·filing 2003–2006
85Inventor score
Top patents by PatentIndex Score
10 records- 0191US7663234B2Package of a semiconductor device with a flexible wiring substrate and method for the sameUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 16, 2010·24 cites·8 claims
- 0276US7060592B2Image sensor and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jun 13, 2006·18 cites·13 claims
- 0375US7303400B2Package of a semiconductor device with a flexible wiring substrate and method for the sameUNITED MICROELECTRONICS CORP·Filed 2005·Granted Dec 4, 2007·6 cites·12 claims
- 0472US6930398B1Package structure for optical image sensing integrated circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 16, 2005·18 cites·14 claims
- 0571US7009287B2Chip on photosensitive device package structure and electrical connection thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 7, 2006·16 cites·16 claims
- 0657US7663693B2Camera moduleUNITED MICROELECTRONICS CORP·Filed 2004·Granted Feb 16, 2010·3 cites·12 claims
- 0752US7359002B2Camera module and method for packaging the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Apr 15, 2008·3 cites·16 claims
- 0847US2006180860A1Image sensorPAN JUI-HSIANG·Filed 2006·Application pending·0 cites
- 0944US2006113654A1Package of a semiconductor device with a flexible wiring substrate and method for the sameUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1037US2005161815A1Package of a semiconductor device with a flexible wiring substrate and method for the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →