Inventor · disambiguated record
Kuan-Wen Fong
Also filed as: FONG KUAN-WEN
2 granted patents·2 pending applications·1 citations·filing 2018–2021
32Inventor score
Technology areasH10W
Files withUNIMICRON TECHNOLOGY CORP4
Top patents by PatentIndex Score
4 records- 0165US10943846B2Chip package structure with heat conductive component and manufacturing thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Mar 9, 2021·1 cites·7 claims
- 0255US2021159142A1Manufacturing method of chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0340US10964634B2Method of manufacturing circuit carrier with embedded semiconductor substrateUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
- 0433US2020029433A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kuan-Wen Fong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →