Inventor · disambiguated record
Kun-Chen Ho
Also filed as: HO KUN-CHEN
12 granted patents·5 pending applications·4 citations·filing 2018–2024
84Inventor score
Top patents by PatentIndex Score
17 records- 0187US11450558B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·9 claims
- 0286US11387408B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 12, 2022·1 cites·6 claims
- 0385US12133474B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 29, 2024·0 cites·5 claims
- 0482US10910553B1Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·1 cites·6 claims
- 0580US2025098271A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0680US2025098272A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0780US2025079237A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0880US2025098273A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0979US11812669B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 7, 2023·0 cites·5 claims
- 1074US12206007B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 21, 2025·0 cites·5 claims
- 1174US12183626B2Metal interconnect structure having cap layer with different thicknesses and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
- 1271US12501835B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 16, 2025·0 cites·9 claims
- 1360US12444652B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 14, 2025·0 cites·15 claims
- 1456US10784153B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 1553US2025267880A1Mim structure with rounded sidewall and fabricating method of the sameUNITED MICROELECTNONICS CORP·Filed 2024·Application pending·0 cites
- 1648US11882769B2Magnetoresistive random access memory structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·14 claims
- 1746US11527710B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 13, 2022·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →