Inventor · disambiguated record
Kuan-Lin Ho
Also filed as: HO KUAN-LIN
55 granted patents·8 pending applications·148 citations·filing 2012–2025
98Inventor score
Top patents by PatentIndex Score
63 records- 0197US10157871B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·20 cites·20 claims
- 0296US10163754B2Lid design for heat dissipation enhancement of die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·31 cites·20 claims
- 0395US9735043B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·20 claims
- 0494US12165946B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·1 cites·15 claims
- 0594US9865566B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 0693US9812410B2Lid structure for a semiconductor device package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·7 cites·20 claims
- 0792US9673119B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·10 cites·20 claims
- 0891US11894312B2Semiconductor packages and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·1 cites·20 claims
- 0990US11315862B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 1090US8916419B2Lid attach process and apparatus for fabrication of semiconductor packagesCHEN CHIN-LIANG·Filed 2012·Granted Dec 23, 2014·11 cites·20 claims
- 1189US10157863B2Method for forming a lid structure for a semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·4 cites·20 claims
- 1288US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
- 1388US2025062184A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1487US10957672B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 23, 2021·3 cites·20 claims
- 1586US11417643B2Package-on-package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 1685US11824032B2Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·1 cites·20 claims
- 1784US11424220B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
- 1883US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
- 1982US2025309130A1Three-dimensional (3d) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2081US12424562B2Three-dimensional (3D) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 2181US2025309083A1Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2281US2025300113A1Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2380US11688693B2Semiconductor packages and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·1 cites·18 claims
- 2480US10157772B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 2580US2024387457A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2679US12062604B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 2779US11784106B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 2878US12347802B2Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2978US11908835B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 3077US12417969B2Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 3177US11616037B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 3276US10276508B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 3375US10804245B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·8 claims
- 3475US10700031B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·1 cites·20 claims
- 3575US9941186B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·1 cites·18 claims
- 3674US11749594B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 3773US9893043B2Method of manufacturing a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 3872US11264304B2Semiconductor structure and associated method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 3971US11972956B2Lid attach process and dispenser headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·24 claims
- 4071US11508640B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·14 claims
- 4171US11355461B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 4270US11594479B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 4370US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
- 4469US11011431B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·0 cites·20 claims
- 4569US9142523B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·2 cites·20 claims
- 4668US9805997B2Packaging methods for semiconductor devices with encapsulant ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·19 claims
- 4766US2021210464A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4864US10622278B2Semiconductor structure and associated method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 4963US10269679B2Semiconductor structure and associated method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·0 cites·20 claims
- 5062US10777467B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →