Inventor · disambiguated record
Ku Sun Hong
Also filed as: HONG KU SUN
2 granted patents·75 citations·filing 2000–2000
63Inventor score
Technology areasH10W
Files withAMKOR TECHNOLOGY INC2
Top patents by PatentIndex Score
2 records- 0189US6525406B1Semiconductor device having increased moisture path and increased solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·69 cites·43 claims
- 0251US6616436B1Apparatus for manufacturing semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 9, 2003·6 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →