Inventor · disambiguated record
Kun-Che Hsieh
Also filed as: HSIEH KUN-CHE
4 granted patents·23 citations·filing 2011–2016
71Inventor score
Top patents by PatentIndex Score
4 records- 0188US8525354B2Bond pad structure and fabricating method thereofWU HUI-MIN·Filed 2011·Granted Sep 3, 2013·14 cites·16 claims
- 0284US9499399B2Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·10 claims
- 0383US8936960B1Method for fabricating an integrated deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 20, 2015·5 cites·19 claims
- 0456US10927000B2MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 23, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →