Inventor · disambiguated record
Kuan-Kan Hu
Also filed as: HU KUAN · HU KUAN-KAN
7 granted patents·30 pending applications·1 citations·filing 2021–2025
72Inventor score
Top patents by PatentIndex Score
37 records- 0191US12132079B2Bonding and isolation techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 0279US2025366161A1Vertically stacked complementary field effect transistors and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0379US2025359312A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0477US2025359278A1Semiconductor device with conductive liners over silicide structures and method of making the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0577US2025351490A1Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025336883A1Apparatus and bonding process for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2025359183A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US2025357197A1Thermal conductive barrier layer in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US2025366104A1Complementary field effect transistor with conductive through substrate layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1075US2025316482A1Gate electrode deposition in stacking transistors and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1175US2025351450A1Metal features of a semiconductor device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1274US2025318250A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1373US2025275180A1Nano-Sheet-Based Complementary Metal-Oxide-Semiconductor Devices With Asymmetric Inner SpacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1473US2024379748A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1572US12484253B2Metal features of a semiconductor device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1672US2025063758A1Conductive structures and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1772US2025246575A1Apparatus and Bonding Process for Wafer BondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1871US2025095997A1Gate electrode deposition in stacking transistors and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1969US2024363421A1Semiconductor Devices With A Rare Earth Metal Oxide LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2069US2025140607A1Thermal conductive barrier layer in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2168US12433006B2Semiconductor device with conductive liners over silicide structures and method of making the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 2268US12432977B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 2368US2025031419A1Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2468US2025169161A1Vertically stacked complementary field effect transistors and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2567US12363992B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 2667US2024321883A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2765US12170331B2Conductive structures and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 2864US12062576B2Semiconductor devices with a rare earth metal oxide layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 2962US2025224333A1Thermal property measurement method for 3d thermal imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3062US2024072115A1Complementary field effect transistor with conductive through substrate layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3160US2025357256A1Thermal conductive bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3258US2024282815A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3358US2025118619A1Thermal conductive bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3457US2024306366A1Semiconductor structure and method for preparing sameICLEAGUE TECH CO LTD·Filed 2024·Application pending·0 cites
- 3554US2025006561A1Stacked multi-gate device with reduced contact resistance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3651US2023402366A1Semiconductor device including metal surrounding via contact and method of forming the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3751US2025006742A1Stacked multi-gate device with low contact via resistance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →