Inventor · disambiguated record
Kunzhong Hu
Also filed as: HU KUNZHONG · HU KUNZHONG KEVIN
61 granted patents·30 pending applications·722 citations·filing 2006–2025
99Inventor score
Top patents by PatentIndex Score
91 records- 0198US11587909B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2020·Granted Feb 21, 2023·9 cites·18 claims
- 0298US11309246B2High density 3D interconnect configurationAPPLE INC·Filed 2020·Granted Apr 19, 2022·10 cites·20 claims
- 0398US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0498US9601471B2Three layer stack structureAPPLE INC·Filed 2015·Granted Mar 21, 2017·34 cites·16 claims
- 0598US9559081B1Independent 3D stackingAPPLE INC·Filed 2015·Granted Jan 31, 2017·268 cites·19 claims
- 0697US11862557B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2021·Granted Jan 2, 2024·4 cites·11 claims
- 0797US11728266B2Die stitching and harvesting of arrayed structuresAPPLE INC·Filed 2020·Granted Aug 15, 2023·6 cites·14 claims
- 0897US11309895B2Systems and methods for implementing a scalable systemAPPLE INC·Filed 2020·Granted Apr 19, 2022·14 cites·18 claims
- 0997US10943869B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2017·Granted Mar 9, 2021·22 cites·20 claims
- 1097US10742217B2Systems and methods for implementing a scalable systemAPPLE INC·Filed 2019·Granted Aug 11, 2020·31 cites·21 claims
- 1197US9935076B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2016·Granted Apr 3, 2018·16 cites·10 claims
- 1297US9935087B2Three layer stack structureAPPLE INC·Filed 2017·Granted Apr 3, 2018·23 cites·14 claims
- 1397US9679801B2Dual molded stack TSV packageAPPLE INC·Filed 2015·Granted Jun 13, 2017·25 cites·17 claims
- 1497US9659907B2Double side mounting memory integration in thin low warpage fanout packageAPPLE INC·Filed 2015·Granted May 23, 2017·26 cites·20 claims
- 1596US12368137B2High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2023·Granted Jul 22, 2025·2 cites·19 claims
- 1696US12283549B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2023·Granted Apr 22, 2025·2 cites·15 claims
- 1796US11749631B2Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliabilityAPPLE INC·Filed 2020·Granted Sep 5, 2023·4 cites·16 claims
- 1896US9589936B23D integration of fanout wafer level packagesAPPLE INC·Filed 2015·Granted Mar 7, 2017·19 cites·20 claims
- 1995US12087689B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2023·Granted Sep 10, 2024·2 cites·16 claims
- 2094US11831312B2Systems and methods for implementing a scalable systemAPPLE INC·Filed 2022·Granted Nov 28, 2023·2 cites·18 claims
- 2193US11646302B2Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ringAPPLE INC·Filed 2020·Granted May 9, 2023·4 cites·30 claims
- 2293US11594494B2High density interconnection using fanout interposer chipletAPPLE INC·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 2393US10056327B2SOC with integrated voltage regulator using preformed MIM capacitor waferAPPLE INC·Filed 2017·Granted Aug 21, 2018·7 cites·20 claims
- 2493US7804131B2Multi-chip moduleINT RECTIFIER CORP·Filed 2007·Granted Sep 28, 2010·29 cites·20 claims
- 2592US12119304B2Very fine pitch and wiring density organic side by side chiplet integrationAPPLE INC·Filed 2021·Granted Oct 15, 2024·2 cites·28 claims
- 2691US11158607B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2019·Granted Oct 26, 2021·4 cites·19 claims
- 2791US10770433B1High bandwidth die to die interconnect with package area reductionAPPLE INC·Filed 2019·Granted Sep 8, 2020·5 cites·20 claims
- 2890US11735526B2High density 3D interconnect configurationAPPLE INC·Filed 2022·Granted Aug 22, 2023·1 cites·20 claims
- 2990US11735567B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2021·Granted Aug 22, 2023·1 cites·22 claims
- 3090US10181455B23D thin profile pre-stacking architecture using reconstitution methodAPPLE INC·Filed 2017·Granted Jan 15, 2019·6 cites·19 claims
- 3189US10818632B1Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2018·Granted Oct 27, 2020·3 cites·14 claims
- 3289US8253224B2Semiconductor package with metal strapsHU KUNZHONG·Filed 2010·Granted Aug 28, 2012·10 cites·11 claims
- 3389US7304372B2Semiconductor packageINT RECTIFIER CORP·Filed 2006·Granted Dec 4, 2007·19 cites·11 claims
- 3485US11967528B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 3585US9449899B2Semiconductor package with heat spreaderINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2013·Granted Sep 20, 2016·5 cites·10 claims
- 3684US2025046715A1High Density 3D Interconnect ConfigurationAPPLE INC·Filed 2024·Application pending·0 cites
- 3783US12322730B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·13 claims
- 3883US9748227B2Dual-sided silicon integrated passive devicesAPPLE INC·Filed 2016·Granted Aug 29, 2017·3 cites·11 claims
- 3983US8957694B2Wafer level package resistance monitor schemeHU KUNZHONG·Filed 2012·Granted Feb 17, 2015·7 cites·18 claims
- 4081US2024039539A1Systems and methods for implementing a scalable systemAPPLE INC·Filed 2023·Application pending·0 cites
- 4180US12159835B2High density 3D interconnect configurationAPPLE INC·Filed 2023·Granted Dec 3, 2024·0 cites·17 claims
- 4280US11158621B2Double side mounted large MCM package with memory channel length reductionAPPLE INC·Filed 2020·Granted Oct 26, 2021·1 cites·18 claims
- 4380US7728420B2High current lead electrode for semiconductor deviceINT RECTIFIER CORP·Filed 2007·Granted Jun 1, 2010·9 cites·14 claims
- 4479US2025029921A1Selectable Monolithic or External Scalable Die-to-Die Interconnection System MethodologyAPPLE INC·Filed 2024·Application pending·0 cites
- 4579US2025167048A1Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator ModuleAPPLE INC·Filed 2025·Application pending·0 cites
- 4678US9691701B2SOC with integrated voltage regulator using preformed MIM capacitor waferAPPLE INC·Filed 2016·Granted Jun 27, 2017·2 cites·18 claims
- 4777US2025157991A1Wafer reconstitution and die-stitchingAPPLE INC·Filed 2025·Application pending·0 cites
- 4876US2025158619A1Systems and methods for implementing a scalable systemAPPLE INC·Filed 2025·Application pending·0 cites
- 4976US2025157939A1High density interconnection using fanout interposer chipletAPPLE INC·Filed 2025·Application pending·0 cites
- 5075US11670548B2Structure and method for fabricating a computing system with an integrated voltage regulator moduleAPPLE INC·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →