Inventor · disambiguated record
Kun-Ting Hung
Also filed as: HUNG KUN-TING
3 granted patents·3 citations·filing 2009–2021
52Inventor score
Top patents by PatentIndex Score
3 records- 0177US10103128B2Semiconductor package incorporating redistribution layer interposerMEDIATEK INC·Filed 2017·Granted Oct 16, 2018·3 cites·19 claims
- 0254US12021068B2Semiconductor device with dummy thermal features on interposerMEDIATEK INC·Filed 2021·Granted Jun 25, 2024·0 cites·13 claims
- 0342US8089164B2Substrate having optional circuits and structure of flip chip bondingLIN KO-WEI·Filed 2009·Granted Jan 3, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →