Inventor · disambiguated record
Kuo-Shu Kao
Also filed as: KAO KUO-SHU
14 granted patents·4 pending applications·19 citations·filing 2007–2024
87Inventor score
Top patents by PatentIndex Score
18 records- 0178USD976852SPower moduleIND TECH RES INST·Filed 2020·Granted Jan 31, 2023·8 cites·1 claims
- 0276US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0374US10490478B2Chip packaging and composite system boardIND TECH RES INST·Filed 2017·Granted Nov 26, 2019·2 cites·29 claims
- 0472US11776867B2Chip packageIND TECH RES INST·Filed 2022·Granted Oct 3, 2023·0 cites·8 claims
- 0567US7932600B2Electrical connecting structure and bonding structureTAIWAN TFT LCD ASS·Filed 2008·Granted Apr 26, 2011·4 cites·19 claims
- 0664US11387159B2Chip packageIND TECH RES INST·Filed 2020·Granted Jul 12, 2022·0 cites·8 claims
- 0764US8466374B2Base for circuit board, circuit board, and method of fabricating thereofTSANG NGAI·Filed 2009·Granted Jun 18, 2013·3 cites·8 claims
- 0862US12349293B2Combined power moduleIND TECH RES INST·Filed 2023·Granted Jul 1, 2025·0 cites·11 claims
- 0957US12381133B2Power semiconductor deviceIND TECH RES INST·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 1057US10622274B2Chip packageIND TECH RES INST·Filed 2018·Granted Apr 14, 2020·0 cites·19 claims
- 1156US2024243097A1Power module package structureIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1252US9161455B2Method of fabricating of circuit boardTSANG NGAI·Filed 2013·Granted Oct 13, 2015·0 cites·6 claims
- 1349US9308603B2Solder, solder joint structure and method of forming solder joint structureIND TECH RES INST·Filed 2013·Granted Apr 12, 2016·0 cites·7 claims
- 1446US2008284011A1Bump structureTAIWAN TFT LCD ASS·Filed 2007·Application pending·0 cites
- 1544US11114387B2Electronic packaging structureIND TECH RES INST·Filed 2018·Granted Sep 7, 2021·0 cites·5 claims
- 1644US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 1736US2018233477A1Electronic packaging structureIND TECH RES INST·Filed 2017·Application pending·0 cites
- 1834USD1094288SPower moduleIND TECH RES INST·Filed 2023·Granted Sep 23, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →