Inventor · disambiguated record
Kuanlin Ku
Also filed as: KU KUANLIN
0 granted patents·4 pending applications·0 citations·filing 2018–2019
Top patents by PatentIndex Score
4 records- 0151US2020149178A1Method for forming electroplated copper on surface of non-metal material by graphene-based inkNANJING GRAPHENE RES INSTITUTE CORPORATION·Filed 2018·Application pending·0 cites
- 0251US2019145008A1Method of forming copper metal layer on non-metallic materialBGT MAT LIMITED·Filed 2019·Application pending·0 cites
- 0343US2020128666A1Flexible printed circuit and method for manufacturing the sameBGT MAT LIMITED·Filed 2018·Application pending·0 cites
- 0438US2020221574A1Amethod for forming trace of circuit boardBGT MAT LIMITED·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →