Method of forming copper metal layer on non-metallic material

Abstract

A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

What is claimed is: 
     
         1 . A method of forming a copper metal layer on a non-metallic material comprising:
 a. providing a carbon-based electroless-plating inks;   b. spraying the carbon-based electroless-plating inks on the non-metallic material;   c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and   d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution so as to form the copper metal layer on the carbon-based electroless-plating inks of the non-metallic material.   
     
     
         2 . The method as claimed in  claim 1 , wherein the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth. 
     
     
         3 . The method as claimed in  claim 1 , wherein the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent 
     
     
         4 . The method as claimed in  claim 3 , wherein the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders. 
     
     
         5 . The method as claimed in  claim 4 , wherein a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders, a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks. 
     
     
         6 . The method as claimed in  claim 3 , wherein the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material. 
     
     
         7 . The method as claimed in  claim 4 , wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon. 
     
     
         8 . The method as claimed in  claim 3 , wherein the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks. 
     
     
         9 . The method as claimed in  claim 3 , wherein the dispersant is ionic dispersant or nonionic dispersant, and the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.