Inventor · disambiguated record
Kuang-Shin Lee
Also filed as: LEE KUANG · LEE KUANG-SHIN
8 granted patents·1 pending application·76 citations·filing 2003–2006
87Inventor score
Top patents by PatentIndex Score
9 records- 0176US7060592B2Image sensor and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jun 13, 2006·18 cites·13 claims
- 0272US6930398B1Package structure for optical image sensing integrated circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 16, 2005·18 cites·14 claims
- 0371US7009287B2Chip on photosensitive device package structure and electrical connection thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 7, 2006·16 cites·16 claims
- 0462US7531381B2Manufacturing method of a quad flat no-lead package structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 12, 2009·2 cites·12 claims
- 0562US7291908B2Quad flat no-lead package structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Nov 6, 2007·9 cites·2 claims
- 0657US7663693B2Camera moduleUNITED MICROELECTRONICS CORP·Filed 2004·Granted Feb 16, 2010·3 cites·12 claims
- 0756US7091585B2Process for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2004·Granted Aug 15, 2006·6 cites·18 claims
- 0852US6921681B2Process for manufacturing photosensitive moduleUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jul 26, 2005·4 cites·6 claims
- 0939US2006211232A1Method for Manufacturing Gold BumpsLIU MEI-JEN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →