Inventor · disambiguated record
Kun-Tack Lee
Also filed as: LEE KUN-TACK
56 granted patents·22 pending applications·569 citations·filing 1999–2025
98Inventor score
Top patents by PatentIndex Score
78 records- 0197US8344385B2Vertical-type semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 1, 2013·43 cites·20 claims
- 0296US7488688B2Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 10, 2009·250 cites·19 claims
- 0393US10679843B2Method of treating substrates using supercritical fluidsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·7 cites·10 claims
- 0489US10029332B2Spot heater and device for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 24, 2018·6 cites·16 claims
- 0588US8766343B2Integrated circuit capacitors having sidewall supportsKANG DAE-HYUK·Filed 2012·Granted Jul 1, 2014·10 cites·20 claims
- 0688US8119476B2Methods of forming integrated circuit capacitors having sidewall supports and capacitors formed therebyKANG DAE-HYUK·Filed 2010·Granted Feb 21, 2012·10 cites·16 claims
- 0787US10083829B2Apparatus for treating substrates using supercritical fluids, substrate treatment system including the same and method of treating substrates using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 25, 2018·4 cites·14 claims
- 0887US8790470B2Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methodsLEE HYO-SAN·Filed 2011·Granted Jul 29, 2014·8 cites·35 claims
- 0987US6565736B2Wet process for semiconductor device fabrication using anode water containing oxidative substances and cathode water containing reductive substances, and anode water and cathode water used in the wet processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 20, 2003·42 cites·23 claims
- 1084US8084367B2Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methodsLEE HYO-SAN·Filed 2007·Granted Dec 27, 2011·9 cites·31 claims
- 1184US6610596B1Method of forming metal interconnection using plating and semiconductor device manufactured by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 26, 2003·33 cites·14 claims
- 1283US10985036B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 20, 2021·3 cites·17 claims
- 1382US8585917B2Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methodsLEE HYO-SAN·Filed 2011·Granted Nov 19, 2013·5 cites·36 claims
- 1481US6399552B1Aqueous cleaning solution for removing contaminants surface of circuit substrate cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 4, 2002·40 cites·13 claims
- 1580US2025359022A1Semiconductor memory device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1679US10576582B2Spot heater and device for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·2 cites·12 claims
- 1779US7498217B2Methods of manufacturing semiconductor memory devices with unit cells having charge trapping layersSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 3, 2009·9 cites·26 claims
- 1878US7745338B2Method of forming fine pitch hardmask patterns and method of forming fine patterns of semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 29, 2010·7 cites·34 claims
- 1978US7153370B2Method of cleaning semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 26, 2006·5 cites·16 claims
- 2077US7857939B2Apparatus for treating wafers using supercritical fluidSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 28, 2010·4 cites·11 claims
- 2176US12042828B2Wafer cleaning apparatus and wafer cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·12 claims
- 2276US8597081B2Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unitCHOI JAE-KWANG·Filed 2011·Granted Dec 3, 2013·4 cites·20 claims
- 2375US6860277B2Single type of semiconductor wafer cleaning deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 1, 2005·16 cites·20 claims
- 2474US8795541B2Substrate processing method and substrate processing system for performing the sameCHO YONG-JHIN·Filed 2011·Granted Aug 5, 2014·3 cites·11 claims
- 2574US6701942B2Method of and apparatus for removing contaminants from surface of a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 9, 2004·15 cites·21 claims
- 2674US2025273455A1Substrate drying apparatus and semiconductor device manufacturing method using sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2773US11605545B2Wafer cleaning equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 14, 2023·1 cites·20 claims
- 2873US8951383B2Apparatus for treating wafers using supercritical fluidLEE HYO-SAN·Filed 2010·Granted Feb 10, 2015·2 cites·13 claims
- 2971US8110499B2Method of forming a contact structureKANG DAE-HYUK·Filed 2009·Granted Feb 7, 2012·5 cites·15 claims
- 3070US12408323B2Semiconductor memory device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 3170US11862457B2Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 2, 2024·0 cites·15 claims
- 3270US2023343613A1Multi-chamber apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3369US8211804B2Methods of forming a hole having a vertical profile and semiconductor devices having a vertical holeLEE HYO-SAN·Filed 2011·Granted Jul 3, 2012·2 cites·20 claims
- 3468US11227761B2Method of removing chemicals from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·9 claims
- 3567US12322587B2Substrate drying apparatus and semiconductor device manufacturing method using sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 3666US8557651B2Method of manufacturing a semiconductor device using an etchantLEE HYO-SAN·Filed 2011·Granted Oct 15, 2013·2 cites·19 claims
- 3765US11648594B2Wafer cleaning apparatus and wafer cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·0 cites·8 claims
- 3863US7141123B2Method of and apparatus for removing contaminants from surface of a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 28, 2006·7 cites·4 claims
- 3962US11887868B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·17 claims
- 4062US11581182B2Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·18 claims
- 4161US11721565B2Multi-chamber apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 8, 2023·0 cites·8 claims
- 4261US9754806B2Apparatus for treating wafers using supercritical fluidSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 5, 2017·0 cites·19 claims
- 4361US7825030B2Method of forming a spacerSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 2, 2010·1 cites·8 claims
- 4459US11986921B2Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 4558US12165866B2Wafer cleaning apparatus and wafer cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 4658US7237561B2Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 3, 2007·5 cites·10 claims
- 4757US7704828B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 27, 2010·1 cites·26 claims
- 4857US7265040B2Cleaning solution and method for selectively removing layer in a silicidation processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 4, 2007·4 cites·30 claims
- 4953US2014283886A1Substrate processing method and substrate processing system for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 5052US11923216B2Apparatus and method for treating substrate including process chambers and transfer chamberSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·19 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →