Inventor · disambiguated record
Kuolung Lei
Also filed as: LEI KUOLUNG · LEI KUOLUNG (DINO)
11 granted patents·1 pending application·84 citations·filing 2003–2024
88Inventor score
Top patents by PatentIndex Score
12 records- 0193US7955885B1Methods of forming packaged micro-electromechanical devicesINTEGRATED DEVICE TECH·Filed 2009·Granted Jun 7, 2011·27 cites·7 claims
- 0291US10640367B2Water proofing and water detection schemes for MEMS-based environmental sensing devicesAPPLE INC·Filed 2018·Granted May 5, 2020·9 cites·15 claims
- 0387US10113915B1Non-contact temperature measurement sensorMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Oct 30, 2018·5 cites·19 claims
- 0487US8426233B1Methods of packaging microelectromechanical resonatorsLEI KUOLUNG·Filed 2011·Granted Apr 23, 2013·13 cites·18 claims
- 0577US7871857B1Methods of forming multi-chip semiconductor substratesINTEGRATED DEVICE TECH·Filed 2008·Granted Jan 18, 2011·8 cites·15 claims
- 0672US10436647B2Non-contact temperature measurement sensorMAXIM INTEGRATED PRODUCTS·Filed 2018·Granted Oct 8, 2019·1 cites·12 claims
- 0768US6784089B2Flat-top bumping structure and preparation methodAPTOS CORP·Filed 2003·Granted Aug 31, 2004·18 cites·28 claims
- 0866US11305984B2Water proofing and water detection schemes for MEMS-based environmental sensing devicesAPPLE INC·Filed 2020·Granted Apr 19, 2022·0 cites·14 claims
- 0960US2025085179A1Pressure sensor with integrated fluid cavityAPPLE INC·Filed 2024·Application pending·0 cites
- 1050US9738511B2Reduction of chipping damage to MEMS structureINVENSENSE INC·Filed 2014·Granted Aug 22, 2017·0 cites·6 claims
- 1147US7141875B2Flexible multi-chip module and method of making the sameAPTOS CORP·Filed 2004·Granted Nov 28, 2006·3 cites·59 claims
- 1246US7842613B1Methods of forming microelectronic packaging substrates having through-substrate vias thereinINTEGRATED DEVICE TECH·Filed 2009·Granted Nov 30, 2010·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →