Inventor · disambiguated record
Kun-Yuan Liao
Also filed as: LIAO KUN-YUAN
41 granted patents·10 pending applications·187 citations·filing 2000–2024
97Inventor score
Top patents by PatentIndex Score
51 records- 0198US9209273B1Method of fabricating metal gate structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 8, 2015·59 cites·20 claims
- 0296US9530851B1Semiconductor device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·15 cites·20 claims
- 0395US9543211B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·15 cites·17 claims
- 0493US9230864B1Method of forming a semiconductor device having a metal gateUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jan 5, 2016·18 cites·11 claims
- 0592US9263540B1Metal gate structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·8 cites·5 claims
- 0689US9780193B2Device with reinforced metal gate spacer and method of fabricatingUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 3, 2017·6 cites·6 claims
- 0789US9698255B2Semiconductor device having gate structure with doped hard maskUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 4, 2017·5 cites·8 claims
- 0889US9490334B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 8, 2016·8 cites·4 claims
- 0988US10109525B1Fabrication method and structure of semiconductor device with contact and plugUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·5 cites·20 claims
- 1087US9673100B2Semiconductor device having contact plug in two dielectric layers and two etch stop layersUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·7 cites·6 claims
- 1187US9640484B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 2, 2017·4 cites·8 claims
- 1285US10916694B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·2 cites·5 claims
- 1385US10103250B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·3 cites·7 claims
- 1485US9214392B1Method of forming contact hole and semiconductor structure with contact plugUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 15, 2015·7 cites·13 claims
- 1583US12471498B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·5 claims
- 1683US9728455B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 8, 2017·3 cites·8 claims
- 1782US10062584B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·3 cites·19 claims
- 1882US9685531B2Method for manufacturing semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 20, 2017·3 cites·11 claims
- 1981US9711411B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 18, 2017·3 cites·15 claims
- 2081US9324620B2Metal gate structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 26, 2016·6 cites·13 claims
- 2180US9985123B2Method for fabricating a semiconductor device having gate structure with doped hard maskUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·2 cites·6 claims
- 2279US12261052B2High electron mobility transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Mar 25, 2025·0 cites·4 claims
- 2377US11778922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
- 2477US10332978B2Device with reinforced metal gate spacer and method of fabricatingUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·2 cites·15 claims
- 2575US11737370B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 2675US11706993B2Method of manufacturing magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 18, 2023·0 cites·6 claims
- 2768US12002681B2High electron mobility transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 4, 2024·0 cites·10 claims
- 2867US9865593B1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 9, 2018·1 cites·21 claims
- 2962US9748349B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 29, 2017·1 cites·12 claims
- 3061US10854520B2Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 1, 2020·0 cites·9 claims
- 3161US9337084B1Method for manufacturing contact holes of a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 10, 2016·1 cites·14 claims
- 3259US11881409B2Method of cutting finUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·8 claims
- 3356US9793382B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 17, 2017·0 cites·12 claims
- 3454US2024420991A1Semiconductor device with deep trench isolation and shallow trench isolation and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3553US10199374B2Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 5, 2019·0 cites·8 claims
- 3652US2019252259A1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3751US9773890B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 26, 2017·0 cites·9 claims
- 3851US9455135B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Sep 27, 2016·0 cites·8 claims
- 3951US2024006525A1Method for manufacturing high electron mobility transistor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 4050US2023006041A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 4149US9583388B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·0 cites·5 claims
- 4247US9263294B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 16, 2016·0 cites·17 claims
- 4345US10192825B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·17 claims
- 4445US2007272270A1Single-wafer cleaning procedureLIAO KUN-YUAN·Filed 2007·Application pending·0 cites
- 4545US2016043030A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4645US2016020144A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4743US2016064528A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4841US9543203B1Method of fabricating a semiconductor structure with a self-aligned contactUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·0 cites·14 claims
- 4940US9799550B2Manufacturing method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 24, 2017·0 cites·18 claims
- 5040US2006137711A1Single-wafer cleaning procedureLIAO KUN-YUAN·Filed 2004·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →