Inventor · disambiguated record

Kum Sun Park

Also filed as: PARK KUM SUN

1 granted patent·1 pending application·0 citations·filing 2021–2021

1Inventor score

Technology areasH05K

Files withTSE CO LTD2

Top patents by PatentIndex Score

2 records

0141US2022386479A1Batch joining type multi-layer printed circuit board and manufacturing method of the sameTSE CO LTD·Filed 2021·Application pending·0 cites
0239US12108544B2Multi-layer printed circuit board made of different materials and manufacturing method thereofTSE CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →