Inventor · disambiguated record
Kuang-Hui Tang
Also filed as: TANG KUANG-HUI
6 granted patents·6 pending applications·12 citations·filing 2004–2022
75Inventor score
Top patents by PatentIndex Score
12 records- 0178US9899333B2Method for forming crack-stopping structuresUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·3 cites·6 claims
- 0276US9431350B2Crack-stopping structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 30, 2016·4 cites·12 claims
- 0372US7534653B2Chip packaging processUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 19, 2009·4 cites·10 claims
- 0459US10643911B2Scribe line structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 5, 2020·1 cites·17 claims
- 0554US2009218679A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0652US2008185710A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 0748US2023230930A1Semiconductor structure with backside through silicon vias and method of obtaining die ids thereofUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 0846US9196549B2Method for generating die identification by measuring whether circuit is established in a package structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 24, 2015·0 cites·4 claims
- 0944US11495510B2Semiconductor device package structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
- 1041US2008303177A1Bonding pad structureUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1140US2015255430A1Package structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1239US2005212132A1Chip package and process thereofHSUAN MIN-CHIH·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →