Inventor · disambiguated record
Kuo-Chiang Ting
Also filed as: TING KUO-CHIANG
62 granted patents·48 pending applications·869 citations·filing 2002–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD101TAIWAN SEMICONDUCTOR MFG3LI HOU-JU1LIN JR JUNG1SHEN CHUN-LIANG1
Top patents by PatentIndex Score
110 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 0397US12038599B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·3 cites·20 claims
- 0497US11747563B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 0597US11592618B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 0697US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 0797US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 0897US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 0996US11380611B2Chip-on-wafer structure with chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 1096US10866373B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·9 cites·20 claims
- 1196US8697515B2Method of making a FinFET deviceYIN JOANNA CHAW YANE·Filed 2012·Granted Apr 15, 2014·51 cites·20 claims
- 1295US10746923B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·14 cites·20 claims
- 1395US10050042B2SRAM cell and logic cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·12 cites·20 claims
- 1495US9805984B2FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·13 cites·20 claims
- 1595US8729634B2FinFET with high mobility and strain channelSHEN CHUN-LIANG·Filed 2012·Granted May 20, 2014·581 cites·20 claims
- 1694US11978714B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·1 cites·18 claims
- 1794US9659810B2Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·14 cites·20 claims
- 1893US10468418B2SRAM cell and logic cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·7 cites·20 claims
- 1993US8912610B2Structure and method for MOSFETS with high-K and metal gate structureLIN JR JUNG·Filed 2012·Granted Dec 16, 2014·22 cites·16 claims
- 2092US10304800B2Packaging with substrates connected by conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·10 cites·20 claims
- 2191US10510722B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 2290US10720436B2SRAM cell and logic cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·4 cites·20 claims
- 2390US10170457B2COWOS structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·6 cites·20 claims
- 2489US11164855B2Package structure with a heat dissipating element and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·6 cites·20 claims
- 2589US11156772B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 2689US10546786B2Method of fabricating a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·3 cites·20 claims
- 2788US2024347390A1Method of fabricating a finfet deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2887US12482753B2Semiconductor device having redistribution layers formed on an active wafer and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·1 cites·20 claims
- 2987US12334464B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 3087US10515888B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·4 cites·20 claims
- 3187US2024385398A1Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3287US2025355169A1Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3386US11476184B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·3 cites·20 claims
- 3486US11454773B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 3586US2025273614A1Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3686US2025349747A1Chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3785US12135454B2Structure and process for photonic packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·20 claims
- 3884US12442978B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 3984US12242108B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4084US11508696B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 22, 2022·2 cites·20 claims
- 4183US10515869B1Semiconductor package structure having a multi-thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 4283US10062614B2FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·2 cites·20 claims
- 4383US2024385377A1Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4483US2025266402A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4583US2025314819A1Structure and process for photonic packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4682US12259578B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4781US12392961B2Structure and process for photonic packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 4881US12253729B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 4981US2023350142A1Optical Transceiver and Manufacturing Method ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5079US11980015B2SRAM cell and logic cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →