Inventor · disambiguated record
Kun-Chen Tsai
Also filed as: TSAI KUN-CHEN
10 granted patents·5 pending applications·175 citations·filing 2000–2012
89Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP5HSU SHIH-PING3TSAI KUN-CHEN3TONG LUNG METAL IND CO LTD1UNIMICRON TECH CORPORATION1
Top patents by PatentIndex Score
15 records- 0195US7485970B2Semiconductor package substrate having contact pad protective layer formed thereonPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Feb 3, 2009·37 cites·5 claims
- 0294US8621900B2Electric door lockWU RONG-FAA·Filed 2011·Granted Jan 7, 2014·43 cites·16 claims
- 0388US7081402B2Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Jul 25, 2006·34 cites·7 claims
- 0487US6615630B2Door lockTONG LUNG METAL IND CO LTD·Filed 2000·Granted Sep 9, 2003·37 cites·7 claims
- 0571US7012019B2Circuit barrier structure of semiconductor packaging substrate and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Mar 14, 2006·15 cites·5 claims
- 0663US7174631B2Method of fabricating electrical connection terminal of embedded chipPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Feb 13, 2007·8 cites·5 claims
- 0755US8610006B2Lid for micro-electro-mechanical device and method for fabricating the sameHSU SHIH-PING·Filed 2009·Granted Dec 17, 2013·1 cites·3 claims
- 0854US10080295B2Circuit board structureUNIMICRON TECH CORPORATION·Filed 2012·Granted Sep 18, 2018·0 cites·8 claims
- 0951US8302297B2Method of fabricating a circuit board structureTSAI KUN-CHEN·Filed 2009·Granted Nov 6, 2012·0 cites·13 claims
- 1051US2006223230A1Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the sameHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 1146US2007130763A1Method of fabricating electrical connection terminal of embedded chipPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1246US2006157852A1Circuit barrier structure of semiconductor packaging substrate and method for fabricating the sameHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 1340US2013028450A1Lid, fabricating method thereof, and mems package made therebyUNIMICRON TECHNOLOGY CORP·Filed 2012·Application pending·0 cites
- 1434US8786108B2Package structureTSAI KUN-CHEN·Filed 2011·Granted Jul 22, 2014·0 cites·8 claims
- 1532US2012032282A1Microelectromechanical system (mems) carrier and method of fabricating the sameTSAI KUN-CHEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →