Inventor · disambiguated record
Kuan-Hao Tseng
Also filed as: TSENG KUAN-HAO
9 granted patents·3 pending applications·3 citations·filing 2017–2024
77Inventor score
Top patents by PatentIndex Score
12 records- 0182US10211313B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·3 cites·8 claims
- 0270US11563009B2Semiconductor memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 0362US10879249B2Semiconductor memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 0460US2025132733A1Self-protection circuitry, cascade circuit, and operational amplifier circuitREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0560US2025132734A1Self-protection circuitry, cascade circuit, operational amplifier circuit, and current mirror circuitREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0658US10629695B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 21, 2020·0 cites·9 claims
- 0757US10381353B2Semiconductor memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 13, 2019·0 cites·10 claims
- 0852US11689188B2Signal output circuit and methodREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Jun 27, 2023·0 cites·16 claims
- 0949US11165516B2Calibration system, radio frequency system, and output power linearization method thereofREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Nov 2, 2021·0 cites·18 claims
- 1047US10431497B1Manufacturing method of epitaxial fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 1140US10707135B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 7, 2020·0 cites·13 claims
- 1236US2019221639A1Nanosheet device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →