Inventor · disambiguated record
Kuo-Feng Tseng
Also filed as: TSENG KUO-FENG
10 granted patents·9 pending applications·60 citations·filing 2007–2025
83Inventor score
Files withASML NETHERLANDS BV4WANG CHENG-TU4EDISON OPTO CORP3TAIWAN SEMICONDUCTOR MFG CO LTD2BRIGHTEST TECH TAIWAN CO LTD1
Top patents by PatentIndex Score
19 records- 0190US9581310B2Light-emitting moduleWU CHIEN-JUNG·Filed 2015·Granted Feb 28, 2017·38 cites·22 claims
- 0280US8919427B2Long-acting heat pipe and corresponding manufacturing methodWANG CHENG-TU·Filed 2008·Granted Dec 30, 2014·18 cites·10 claims
- 0376US2024044820A1Methods of inspecting samples with a beam of charged particlesASML NETHERLANDS BV·Filed 2023·Application pending·0 cites
- 0470US10380049B2Multi-host supported universal serial bus hub and automobile head unit using the sameJUMPLUX TECH CO LTD·Filed 2017·Granted Aug 13, 2019·3 cites·13 claims
- 0567US11815473B2Methods of inspecting samples with multiple beams of charged particlesASML NETHERLANDS BV·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 0654US2023046612A1Ion mobility spectrometry-mass spectrometry combined analysis deviceSHIMADZU CORP·Filed 2022·Application pending·0 cites
- 0752US9286970B2Memory circuit for pre-charging and write drivingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·1 cites·17 claims
- 0852US2009308576A1Heat pipe with a dual capillary structure and manufacturing method thereofWANG CHENG-TU·Filed 2008·Application pending·0 cites
- 0951US2009095460A1Stripe-interwoven capillary structure and manufacturing method thereofWANG CHENG-TU·Filed 2007·Application pending·0 cites
- 1049US11302512B2Electron beam inspection apparatus stage positioningASML NETHERLANDS BV·Filed 2020·Granted Apr 12, 2022·0 cites·19 claims
- 1149US2025290868A1Optical inspection systemBRIGHTEST TECH TAIWAN CO LTD·Filed 2025·Application pending·0 cites
- 1247US9495495B2Scan cell assignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·0 cites·20 claims
- 1345US2023114067A1Vibration damping and resonance reduction for ion pumpASML NETHERLANDS BV·Filed 2021·Application pending·0 cites
- 1445US2019301813A1Sleeve-type heat conducting structureCHAUN CHOUNG TECH CORP·Filed 2019·Application pending·0 cites
- 1540US9679915B2Integrated circuit with well and substrate contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·20 claims
- 1639US2009260790A1Metal tubes for heat pipes and method of manufacturing the sameWANG CHENG-TU·Filed 2008·Application pending·0 cites
- 1737US9825207B2Light-emitting diode packaging element for controlling color temperature of lightsEDISON OPTO CORP·Filed 2016·Granted Nov 21, 2017·0 cites·14 claims
- 1835US2016330804A1Light-emitting diode lighting device for being directly electrically connected to alternating current power supplyEDISON OPTO CORP·Filed 2016·Application pending·0 cites
- 1925US9989222B2Light-emitting deviceEDISON OPTO CORP·Filed 2015·Granted Jun 5, 2018·0 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →