Inventor · disambiguated record
Kuan-Yu Wang
Also filed as: WANG KUAN-YU
16 granted patents·42 citations·filing 2011–2022
90Inventor score
Files withUNITED MICROELECTRONICS CORP11TAIWAN SEMICONDUCTOR MFG CO LTD2WU HUI-MIN2SULLSTAR TECH INC1
Top patents by PatentIndex Score
16 records- 0188US8525354B2Bond pad structure and fabricating method thereofWU HUI-MIN·Filed 2011·Granted Sep 3, 2013·14 cites·16 claims
- 0285US8310065B2Semiconductor device and wafer structureWU HUI-MIN·Filed 2011·Granted Nov 13, 2012·9 cites·13 claims
- 0384US9499399B2Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·10 claims
- 0483US8936960B1Method for fabricating an integrated deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 20, 2015·5 cites·19 claims
- 0582US9668064B2Microelectromechanical system microphoneUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 30, 2017·3 cites·15 claims
- 0679US9624092B1Semiconductor structure with micro-electro-mechanical system devicesUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 18, 2017·3 cites·18 claims
- 0774US12002714B2Semiconductor device and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0874US9950920B2Micro-electro-mechanical system structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 24, 2018·2 cites·11 claims
- 0973US11450569B2Semiconductor device and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 1072US10112825B2Semiconductor structure and manufacturing method for the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 30, 2018·1 cites·14 claims
- 1163US10115582B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 30, 2018·1 cites·6 claims
- 1261US10427935B2Manufacturing method for semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·0 cites·5 claims
- 1356US10927000B2MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 23, 2021·0 cites·7 claims
- 1454US10475640B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·4 claims
- 1554US10457546B2Micro-electro-mechanical system structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·0 cites·9 claims
- 1638US10804664B2Crimp tool having adjustable camSULLSTAR TECH INC·Filed 2017·Granted Oct 13, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →