Inventor · disambiguated record
Kuo-Pin Yang
Also filed as: YANG KUO-PIN
17 granted patents·10 pending applications·169 citations·filing 1999–2011
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG18WANG MENG-JEN2YANG KUO-PIN2ADVANCE SEMICONDUCTOR ENGINEER1CHEN KUO-HUA1
Top patents by PatentIndex Score
27 records- 0191US7560744B2Package optical chip with conductive pillarsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 14, 2009·26 cites·8 claims
- 0291US7238590B2Package structure of semiconductor and wafer-level formation thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 3, 2007·24 cites·9 claims
- 0390US8188593B2Silicon substrate having through vias and package having the sameCHEN KUO-HUA·Filed 2010·Granted May 29, 2012·14 cites·18 claims
- 0489US7563652B2Method for encapsulating sensor chipsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 21, 2009·20 cites·14 claims
- 0575US7573124B2Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 11, 2009·7 cites·11 claims
- 0674US7435621B2Method of fabricating wafer level packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 14, 2008·6 cites·15 claims
- 0774US7105424B2Method for preparing arylphosphonite antioxidantADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Sep 12, 2006·26 cites·20 claims
- 0869US6768332B2Semiconductor wafer and testing method for the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·16 cites·14 claims
- 0966US7945062B2Microelectromechanical microphone packaging systemADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 17, 2011·3 cites·7 claims
- 1065US7429499B2Method of fabricating wafer level packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Sep 30, 2008·2 cites·13 claims
- 1159US8643167B2Semiconductor package with through silicon vias and method for making the sameHUNG CHIA-LIN·Filed 2011·Granted Feb 4, 2014·2 cites·20 claims
- 1258US7833815B2Microelectromechanical system package and the method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 16, 2010·1 cites·20 claims
- 1355US8314490B2Chip having a bump and package having the sameYANG KUO-PIN·Filed 2010·Granted Nov 20, 2012·1 cites·20 claims
- 1450US8471156B2Method for forming a via in a substrate and substrate with a viaWANG MENG-JEN·Filed 2009·Granted Jun 25, 2013·0 cites·18 claims
- 1548US2007187711A1Wafer level package for image sensor components and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1647US6369439B1Strip of semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Apr 9, 2002·13 cites·11 claims
- 1747US2008132000A1Chip scale package and method for marking chip scale packagesADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1846US2009140413A1Semiconductor package structure, applications thereof and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1945US2008230885A1Chip hermetic package device and method for producing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2042US2007252261A1Semiconductor device packageWANG MENG-JEN·Filed 2006·Application pending·0 cites
- 2141US2006278974A1Method for forming wafer-level heat spreader structure and package structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2240US6150730AChip-scale semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 21, 2000·8 cites·6 claims
- 2340US2006211173A1Package of image sensor device and formation thereofADVANCE SEMICONDUCTOR ENGINEER·Filed 2006·Application pending·0 cites
- 2438US2006255253A1Method for packaging an image sensor die and a package thereofHSIAO WEI-MIN·Filed 2005·Application pending·0 cites
- 2535US2004188860A1Chip scale package and method for marking the sameFiled 2004·Application pending·0 cites
- 2633US8865520B2Carrier bonding and detaching processes for a semiconductor waferYANG KUO-PIN·Filed 2011·Granted Oct 21, 2014·0 cites·18 claims
- 2733US2004032009A1Semicondutor wafer deviceADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →