Inventor · disambiguated record
Kuan-Lin Yeh
Also filed as: YEH KUAN-LIN
11 granted patents·7 citations·filing 2006–2023
82Inventor score
Top patents by PatentIndex Score
11 records- 0187US9779997B2Semiconductor device and a method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·7 cites·19 claims
- 0278US12300698B2Isolation structure for preventing unintentional merging of epitaxially grown source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0373US11990525B2Isolation structure for isolating epitaxially grown source/drain regions and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0472US12490505B2Gate dielectric having a non-uniform thickness profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0572US11749683B2Isolation structure for preventing unintentional merging of epitaxially grown source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0672US11521971B2Gate dielectric having a non-uniform thickness profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 0767US11315924B2Isolation structure for preventing unintentional merging of epitaxially grown source/drainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 0866US11349002B2Isolation structure for for isolating epitaxially grown source/drain regions and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 0960US12482694B2Electronic package and suction deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 25, 2025·0 cites·6 claims
- 1050US10163718B2Semiconductor device and a method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 1140US7429726B2Image displaying and capturing devicesTPO DISPLAYS CORP·Filed 2006·Granted Sep 30, 2008·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →