Inventor · disambiguated record
Kwong Kei Chin
Also filed as: CHIN KWONG K · CHIN KWONG KEI
10 granted patents·3 pending applications·217 citations·filing 2000–2018
89Inventor score
Top patents by PatentIndex Score
13 records- 0195US6344786B1Telescoping bobbinARTESYN TECHNOLOGIES INC·Filed 2000·Granted Feb 5, 2002·95 cites·51 claims
- 0294US6753749B1Toroidal transformer enclosureARTESYN TECHNOLOGIES INC·Filed 2003·Granted Jun 22, 2004·63 cites·32 claims
- 0390US7567164B2Transformer having reduced size, safety insulation and low leakage inductanceARTESYN TECHNOLOGIES INC·Filed 2005·Granted Jul 28, 2009·22 cites·18 claims
- 0482US10504813B2Heat sink assemblies for surface mounted devicesASTEC INT LTD·Filed 2016·Granted Dec 10, 2019·5 cites·13 claims
- 0581US7130197B2Heat spreaderARTESYN TECHNOLOGIES INC·Filed 2004·Granted Oct 31, 2006·18 cites·25 claims
- 0676US8897029B2Compact isolated switching power convertersKIPPLEY ROBERT H·Filed 2011·Granted Nov 25, 2014·7 cites·27 claims
- 0775US10892085B2Circuit board assemblies having magnetic componentsASTEC INT LTD·Filed 2017·Granted Jan 12, 2021·2 cites·18 claims
- 0874US9165707B2Multiphase power converters having shared magnetic core sectionsKIPPLEY ROBERT H·Filed 2011·Granted Oct 20, 2015·5 cites·16 claims
- 0956US10566131B2Transformers including secondary winding turns having different diametersASTEC INT LTD·Filed 2018·Granted Feb 18, 2020·0 cites·23 claims
- 1047US2007035932A1Heat spreaderARTESYN TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1147US2011075392A1Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive SheetsASTEC INT LTD·Filed 2009·Application pending·0 cites
- 1243US9706638B2Assemblies and methods for directly connecting integrated circuits to electrically conductive sheetsASTEC INT LTD·Filed 2016·Granted Jul 11, 2017·0 cites·9 claims
- 1340US2011074383A1Assemblies and Methods for Sensing Current Through Semiconductor Device LeadsASTEC INT LTD·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →