Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets

Abstract

An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

1 . An integrated circuit assembly comprising:
 a first electrically conductive sheet;   a second electrically conductive sheet electrically isolated from the first electrically conductive sheet;   a non-conductive material disposed between the first and second electrically conductive sheets;   an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets; and   an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace.   
     
     
         2 . The circuit assembly of  claim 1 , wherein the first and second electrically conductive sheets each include a copper core plated with an electrically conductive material. 
     
     
         3 . The circuit assembly of  claim 1 , wherein the first electrically conductive sheet defines at least one input terminal for coupling the circuit assembly to a power source. 
     
     
         4 . The circuit assembly of  claim 3 , wherein the second electrically conductive sheet defines at least one output terminal for coupling the circuit assembly to a load such that, when the integrated circuit is active, a current path is formed through the first electrically conductive sheet including the input terminal, the integrated circuit, and the second electrically conductive sheet including the output terminal. 
     
     
         5 . The circuit assembly of  claim 4 , wherein the first and second electrically conductive sheets are adapted to radiate heat generated by current flow through the current path. 
     
     
         6 . The circuit assembly of  claim 4 , wherein the non-conductive material separates and electrically isolates the first electrically conductive sheet from the second electrically conductive sheet. 
     
     
         7 . The circuit assembly of  claim 1 , wherein the non-conductive material includes a dielectric resin. 
     
     
         8 . The circuit assembly of  claim 1 , wherein the first and second electrically conductive sheets each have a thickness of at least about 0.5 millimeter. 
     
     
         9 . The circuit assembly of  claim 1 , further comprising a control circuit for controlling the integrated circuit, the control circuit electrically connected to the electrical trace. 
     
     
         10 . An integrated circuit assembly comprising:
 a first electrically conductive sheet;   a second electrically conductive sheet electrically isolated from the first electrically conductive sheet;   a non-conductive material disposed between the first and second electrically conductive sheets;   a conductive via formed in at least the non-conductive material and electrically isolated from the first and second electrically conductive sheets;   an integrated circuit positioned on a first side of the electrically conductive sheets and having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the conductive via;   a circuit board positioned on a second side of the electrically conductive sheets; and   at least one control circuit disposed on the circuit board and electrically connected to the conductive via for providing a control signal to the integrated circuit.   
     
     
         11 . The circuit assembly of  claim 10 , wherein the integrated circuit includes a surface-mount power device, and wherein the control circuit is adapted to control the surface-mount power device to control current flow between the first electrically conductive sheet and the second electrically conductive sheet. 
     
     
         12 . The circuit assembly of  claim 11 , wherein the first electrically conductive sheet defines at least one terminal for coupling the circuit assembly to a power source and the second electrically conductive sheet defines at least one terminal for coupling the circuit assembly to a load. 
     
     
         13 . A power converter comprising the circuit assembly of  claim 12 . 
     
     
         14 . The circuit assembly of  claim 12 , wherein the circuit board includes multiple insulated layers and multiple trace layers. 
     
     
         15 . The circuit assembly of  claim 12 , wherein the first and second electrically conductive sheets each have a thickness of at least about 0.5 millimeter. 
     
     
         16 . A method of making an integrated circuit assembly, the method comprising:
 positioning a non-conductive material in an opening defined by one or more electrically conductive sheets;   forming an electrical trace on at least a portion of the non-conductive material; and   soldering at least first and second leads of an integrated circuit directly to said one electrically conductive sheet and the electrical trace, respectively.   
     
     
         17 . The method of  claim 16  wherein soldering includes soldering a third lead of the integrated circuit to a second electrically conductive sheet that is electrically isolated from said one electrically conductive sheet and the electrical trace. 
     
     
         18 . The method of  claim 16  wherein the integrated circuit is positioned on a first side of said one electrically conductive sheet, the method further comprising coupling a circuit board to a second side of said one electrically conductive sheet. 
     
     
         19 . The method of  claim 18  further comprising forming a via through the non-conductive material to electrically connect the electrical trace on the non-conductive material to at least one trace of the circuit board. 
     
     
         20 . The method of  claim 19  further comprising mounting a circuit element to the circuit board with the circuit element electrically connected to the second lead of the integrated circuit through the electrical trace on the non-conductive material, the via, and said one trace of the circuit board.