Inventor · disambiguated record
Kwang-Chul Choi
Also filed as: CHOI KWANG-CHUL
16 granted patents·10 pending applications·141 citations·filing 2004–2023
92Inventor score
Top patents by PatentIndex Score
26 records- 0195US8759147B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2011·Granted Jun 24, 2014·57 cites·18 claims
- 0294US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0392US8450856B2Semiconductor device and method of forming the sameKANG UN-BYOUNG·Filed 2011·Granted May 28, 2013·18 cites·14 claims
- 0488US9023716B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 5, 2015·8 cites·19 claims
- 0581US9875918B2Initiator and method for debonding wafer supporting systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 23, 2018·3 cites·19 claims
- 0681US9006081B2Methods of processing substratesAHN JUNG-SEOK·Filed 2012·Granted Apr 14, 2015·6 cites·8 claims
- 0779US9099541B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·4 cites·8 claims
- 0876US9412636B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·2 cites·20 claims
- 0973US9059072B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2014·Granted Jun 16, 2015·3 cites·4 claims
- 1068US8816509B2Semiconductor package including underfill layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·2 cites·9 claims
- 1167US9589947B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·16 claims
- 1261US9202767B2Semiconductor device and method of manufacturing the sameKIM JI HWANG·Filed 2012·Granted Dec 1, 2015·2 cites·15 claims
- 1360US8890325B2Heterojunction structures of different substrates joined and methods of fabricating the sameKANG UN-BYOUNG·Filed 2011·Granted Nov 18, 2014·1 cites·18 claims
- 1457US2023420374A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2013181343A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1650US9196505B2Semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 24, 2015·0 cites·10 claims
- 1749US2015318268A1Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1847US2012280405A1Semiconductor packages and methods of manufacuring the sameHWANG JIHWAN·Filed 2012·Application pending·0 cites
- 1946US9159659B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·16 claims
- 2045US9595446B2Methods of processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 14, 2017·0 cites·20 claims
- 2145US2006162644A1Light reflector of a guardrail for a roadCHOI KWANG-CHUL·Filed 2004·Application pending·0 cites
- 2241US2012235305A1Semiconductor device and method of manufacturing the sameKIM JI-HWANG·Filed 2012·Application pending·0 cites
- 2338US2013149817A1Fabricating methods of semiconductor devices and pick-up apparatuses of semiconductor devices thereinJEON CHANG-SEONG·Filed 2012·Application pending·0 cites
- 2438US2012223433A1Semiconductor package including connecting member having controlled content ratio of goldJEE YOUNG-KUN·Filed 2012·Application pending·0 cites
- 2535US2016314996A1Substrate treating apparatus and a method for treating a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2634US2013032947A1Semiconductor package and method of manufacturing the samePARK SANG-SICK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →